Electronics Forum | Mon Dec 22 11:09:21 EST 2008 | mfcat
We changed paste manufacturers rather recently and are now seeing SOT23s falling off after wave solder. These parts have a dual process... we stencil print paste, apply glue, populate then reflow. Only SOT23s fall off, chips are fine. We do not be
Electronics Forum | Mon Apr 09 20:55:46 EDT 2012 | action_101
I forgot to add that we are using a 3 mil stencil. It seems like to me that may be there isn't enough flux left when we reach liquidous?? About half of the solder spheres do melt and wet on each pad, but the top half of each solder joint is just the
Electronics Forum | Wed Feb 01 12:20:16 EST 2006 | cvoyles
Hi Bruno, I am an equipment reseller in business since 1994. I have a Smart Sonic MG3000 ultra sonic stencil cleaner in inventory. It is a stainless steel model with Delta Sonics brand ultra sonic generator. It is the guillotine type that raises a
Electronics Forum | Mon Nov 12 16:14:47 EST 2001 | davef
Yes!!! How can we assemble boards with 20 pitch when we allow 0.008� error to the master art? Excellent question!!! IPC-D-300G has nothing to do with assembler requirements. It is written by and for fabricators, so that they can be comfortable.
Electronics Forum | Tue Aug 22 03:04:07 EDT 2006 | PP
Any help/suggestion is much appreciated I am doing lots of BGA Reworks from a small uBGA with a few balls to a large BGA with over 1500 balls. The reworks have been done on SRT 1100 Series Machine for many years. SRT 1100 Machine is good for the c
Electronics Forum | Wed May 13 13:22:39 EDT 2015 | cohlmann
Hello Everyone. We are setting up our first SMT line and are looking for recommendations on printers and reflow ovens. Currently most of our manufacturing is outsourced and we want the ability to manufacture all of our products in-house. One impor
Electronics Forum | Mon Jun 08 14:19:30 EDT 1998 | Gary Simbulan
Earl, et al, Boy things get old and cold around here fast. I promised more detail on my capactior problem and I thought I could drop something completely different in the same message and tell a tale of solder balls. First the caps. We still have
Electronics Forum | Wed Jul 24 17:25:01 EDT 2019 | davef
Your solder stencil design should follow all basic rules for solder stencil design are followed in accordance with IPC-7525 including adherence to an area ratio of 2:3 or greater and an aspect ratio of 1.5 or greater.
Electronics Forum | Mon Aug 14 05:45:16 EDT 2023 | dimamalin
First, this is the result of bad printer setup. Adjust knife pressure, PCB gap, separation speed, tooling, and stencil cleaning. Pay attention to the coating of contacts pad and height of solder mask of PCB.
Electronics Forum | Mon Aug 14 13:08:00 EDT 2023 | dimamalin
Similar issues arose for me in cases where the contact pads of components were located below the solder mask level. Ordering a thinner stencil might potentially solve the problem.
