Electronics Forum: oxidezed board problems (Page 4 of 446)

Fuji machine problems

Electronics Forum | Fri Sep 19 16:33:46 EDT 2008 | mac5

If you're having trouble with a specific board, double check your Pattern, Diameter, Color and Scan Area under the 'Mark Data' tab. You can also try setting the Pitch Tolerance to '0' in the machine configuration. Good Luck, Bill

Re: Pallet problems

Electronics Forum | Fri May 08 16:30:59 EDT 1998 | Chrys

| I am running boards with gold fingers on a pallet for | masking purposes. The pallets worked fine for a while | but know the gold fingers are getting solder on them. We | have tried everythin: new pallets, cleaning the pallet | and board to be s

power relay problems

Electronics Forum | Mon Sep 08 08:59:45 EDT 2008 | davef

You're correct: * Sealed relays should not be cracked or have moisture intrusion. * Hand soldering relays is going to be expensive. [Using a mini-solder pot for this might reduce some of the burden.] The good part is that the problem is gross enough

BGA soldering problems

Electronics Forum | Mon Nov 24 11:19:21 EST 2008 | sjones

I am having problems soldering a Rohs compliant BGA ATMEL AT91RM9200(rohs compliant board) This device recommends a soldering profile from J-STD-20 and a minimum peak package temperature of 250 centigrade,peak 260. However a lot of the other componen

SN100C wetting problems

Electronics Forum | Fri Jul 13 12:20:33 EDT 2007 | jdumont

There are a lot of areas that could be leading to this problem. We have some of these issues on some boards with this solder as well but the hole fill still meets IPC class 3 requirement of 75% vertical hole fill. Through hole diameter is important.

qfp reflow problems

Electronics Forum | Fri Apr 16 08:49:07 EDT 2004 | Chris Lampron

Hi Barry, Your best course of action is to perform a thermal profile and determine exactly what the times/temps are in these locations. Try to match your profile to the recommendations of your solder paste. (Time between 130-160, Time over 183 and m

Kester paste problems

Electronics Forum | Tue May 22 12:27:04 EDT 2007 | cyber_wolf

I would consider calling Kester and telling them they need to send their people out. I could not really see mesh size being an issue on anything 20mil and above. There are several other issues that can cause aperture clogging as well...: Incorrect

Vicor VI Chip problems

Electronics Forum | Tue Feb 28 12:41:36 EST 2017 | deanm

Is anybody using Vicor VI Chips (SMT version)? We are using a number of these on some of our boards and are having inaccurate placement and insufficient solder issues (8 mil step stencil still not enough). If you are placing these devices: 1. Which

Coating adhesion problems

Electronics Forum | Tue Sep 21 11:39:41 EDT 2004 | pabloquintana

Conformal coat a bare board to determine if there > is there is enough surface free energy from your > solder mask to prevent dewetting. Sorry for my ignorance, but what is "enough surface free energy"? How do I determine that? >* Bake a board

MPM AP25, separation problems

Electronics Forum | Fri Oct 28 10:04:02 EDT 2005 | valuems

Hello Since we have a few years experience with these printers we might be able to help. Is these problems always with the same components? Is this a new type of paste for you? Is there tape on the bottom of the stencil? And how much pressure do


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