Electronics Forum | Tue Jun 03 08:15:10 EDT 2003 | davef
On pad design, look here: http://www.smtnet.com/forums/Index.cfm?CFApp=1&Message_ID=18036 On component sizes, look here: http://www.practicalcomponents.com
Electronics Forum | Mon Sep 17 17:49:02 EDT 2001 | arzu
What about the material of the stencil? Nickel formed? stainless steel? even more materials are available, some with different ways to form the apetertures.
Electronics Forum | Wed Mar 20 07:57:30 EST 2002 | davef
Purchase: 7095 - Design and Assembly Process Implementation for BGA's Make every effort to distribute the test pads, because if you keep them massed at the ball, it would be a bijundo kick in the BGA rear section, when all of those pins released.
Electronics Forum | Sat Feb 09 17:33:30 EST 2002 | George Verboven
For more info about Metal Stencil Overview. also look at: http://www.tkb-4u.com/articles/printing/metalstenciloverview/metalstenciloverview.php
Electronics Forum | Fri Mar 03 14:40:22 EST 2006 | amol_kane
i think a more important issue here would be the reduction ratio. as LF solders have a higher surface tension, they do not flow as well as their leaded counterparts. therefore the stencil design may have to be changed (hence a new stencil) if the red
Electronics Forum | Tue Apr 10 02:57:53 EDT 2018 | rob
Yes I would, most of our old Yamaha machines (before 2005) will do 30-35 microns @ 3 sigma with the fine camera option. Our Jukis with His res camera's will hit it too. You should be OK with most things after 1997 with the right camera choice (whic
Electronics Forum | Tue Sep 18 15:35:23 EDT 2001 | jschake
A laser cut stainless steel stencil was used exclusively for the evaluation of the complete 0201 assembly process, which addressed printing, placement, and reflow. However, I have also conducted off-line 0201 print tests using a nickel electroformed
Electronics Forum | Tue Sep 18 11:34:36 EDT 2001 | jschake
The tightest spacing between neighboring 0201 components assembled was 8-mils. Please refer to the response for the query entitled �Minimizing Tombstoning Defects� posted by martys, as the response provided there is also relevant to address this que
Electronics Forum | Tue Nov 28 21:16:17 EST 2006 | davef
J Rose at EMPF says: The introduction of no-clean solder fluxes in electronics manufacturing has given rise to greater levels of solder balling simply because the opportunity to remove them in the wash process does not exist. They are typically cause
Electronics Forum | Fri Apr 10 09:59:13 EDT 2020 | spoiltforchoice
> We unfortunately use GERBER data to digitize <BR> > boards more than any CAD. We are CM and many of <BR> > our customers do not provide CAD. With some <BR> > Legacy products, we still use 274-D Gerbers
