Electronics Forum: pad and spacing (Page 4 of 61)

Min spacing for land patterns from PCB edge

Electronics Forum | Wed Mar 19 09:54:44 EDT 2008 | davef

Here's what we suggest: * Keep a 5-mm space between a board edge and a ceramic capacitor. * Mount the capacitor parallel relative to the edge. * Design pads about a half of the termination. * Fixture the board when using your pizza cutter.

0201 pad layout

Electronics Forum | Fri Jan 06 05:03:11 EST 2012 | richieoreilly

Hi All, Just wondering if anyone is placing 0201 components in volume. If so What pad layout are you using, i.e. pad size, shape and spacing. Also are you pads and fiducials solder mask defined or copper defined. Can you also let me know the rough q

Re: Minimum space recommended for thru-hole, pad to pad

Electronics Forum | Wed Jun 23 18:23:32 EDT 1999 | Tom B.

Even though you may find a pad-pad thru-hole spacing, part body size, orientation, and insertion head tooling clearences may be the deciding factor in spacing. 1. Part body diameter will dictate component centroid spacing. ---[][][][

smt common pad 0402 and 1206 package

Electronics Forum | Fri May 06 06:51:55 EDT 2016 | abhilash4788

Hi All, One of my customer has provided a pcb design having common pad for 0402 and 1206 package(i.e 3 pads in the gerber, pad1,pad2 belongs to 1206 package and pad2,pad3 belongs to 0402 package) Will this create any solderability issue. Is anyone e

force between the pad and laminate material

Electronics Forum | Tue Jun 11 22:06:06 EDT 2002 | scottxiao

I encounter the problem, it is easy for pad(copper) to drop off from the PCB, which is Ni/Au finish. so my question is whether there is any specification about the force between pad and laminate material, and does the PCB corpoartion test this parame

force between the pad and laminate material

Electronics Forum | Mon Jun 17 13:45:29 EDT 2002 | genny

When the pad comes off, is it leaving behind a "black" area? Your board may be suffering from black pad - a condition that occasionally affects ENIG finish boards. It is a process control issue with your board fabricator. The nickel is oxidising b

0402 pad and stencil aperture design

Electronics Forum | Thu Oct 30 15:07:40 EDT 2008 | jemills

Hello I have a new 0402 pad design on a recent board were building in future. On closer look i thought the pad was a thru hole mount , but upon closer inspection the round pads are for 0402 comps. I had a discussion with the engineer and he said

force between the pad and laminate material

Electronics Forum | Thu Jun 20 03:15:22 EDT 2002 | Paul

I've seen a problem recently where there was 2 deposits of Nickle then Gold, The problem is the Nickle will not adhere to Nickle, see if you can scrape the pad away with a scalpel.

smt common pad 0402 and 1206 package

Electronics Forum | Fri May 06 08:47:05 EDT 2016 | davef

You're correct. This design will have a record amount of 0402 rework for tombstoning and misalignments. Suggest that the pads on each end of all components be the same size in order to balance wetting forces during reflow.

0402 pad and stencil aperture design

Electronics Forum | Thu Oct 30 22:29:58 EDT 2008 | davef

For most applications, a nice square [or rectangle] pad works just fine. Assemblers ship boat loads of boards with these every day. It's reasonable for tight decoupling capacitor requirement applications to use round or radiused pads for components


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