Electronics Forum | Thu Mar 08 18:39:06 EST 2007 | elias67
Stencil Thickness should be .005" A reduction along with cross hatching is a must for the center pad to reduce paste volume as well as to assure even paste deposit while printing on a large pad. With out the cross hatch, the squeegie will most like
Electronics Forum | Wed Jul 25 13:29:24 EDT 2007 | realchunks
Hi Lloyd, Homeplates will get rid of solder balling. They are only recommended "backwards" for 0402 or smaller (Points point away from each other). If you do this, you will have a full pad width of paste on the pad for the part to stick in. Obvio
Electronics Forum | Fri Mar 02 16:26:57 EST 2007 | Steve
1- Thickness 0.005" 2- I usually reduce 50% of the thermal pad, but it also depend on original size of thermal pad somehow I have to either create window panel or crosshatch otherwise component wil get wimming during reflow. Hope this will help. Reg
Electronics Forum | Wed Jun 17 05:41:04 EDT 2020 | SMTA-Davandran
I have one product which only need print low temperature solder paste on OSP pad. This pad will used for hot bar process. Desired solder paste thickness is 0.10 mm to 0.15 mm. Is any one can advise right stencil thickness and aperture opening for it.
Electronics Forum | Mon Oct 21 23:48:13 EDT 2002 | harris
Hi: If anyone have the experience with the PCB pad design and stencil design for the uBGA? We meet the problem for it. The component data is 0.3mm diameter and 0.5 pitch. Could anyone tell me the PCB pad dimension, the stencil type and aperture dimes
Electronics Forum | Thu Jun 26 23:57:58 EDT 2014 | selvakumar
refer to this design may helping you.
Electronics Forum | Tue Jun 24 12:56:26 EDT 2014 | jmathis
Hello, As our company has begun doing an increase production of contract manufacturing I have seen more and more designs with the 0402 pad layouts that are smaller (.015 in width) than the component. Also there is only a .008 longer than the 0402 p
Electronics Forum | Wed Feb 27 19:55:13 EST 2002 | nifhail
Hi, I need help to understand further on the via in pad for 0402 requirement. If I were to do the DFM over the brd design which consist of 0402 with via on pad, what is the criteria that I should look for ? I learned that the via in pad does not wor
Electronics Forum | Thu Jun 16 18:16:32 EDT 2005 | davef
Josh: You're correct it's tough to describe the layout of the BGA pads and traces. We wouldn't be too excited about seeing this board either. On one hand, for the obvious lack of care taken in doing the layout, this is a junk board and you shouldn
Electronics Forum | Mon Jun 28 08:25:54 EDT 2004 | Scott Dodge
What is the difference between a smooth finish organic coated bare copper board for fine-pitch components and HASL finish?
