Electronics Forum | Thu Oct 27 13:22:39 EDT 2005 | russ
Thanks for the spec Greg, For us it is the stiffness.
Electronics Forum | Thu Oct 27 14:17:49 EDT 2005 | james
I agree the stiffness is definately the problem.
Electronics Forum | Thu Sep 06 11:24:56 EDT 2018 | davef
pdf "BGA Stencil design guideline for avoid bridge" As you would expect, Google found 40,000+ results in less than a second One of my favorites was Power Point Presentation by Greg Smith [gsmithATfctassembly.com] at FCT Assembly: "Improve SMT Assem
Electronics Forum | Tue Oct 25 14:20:52 EDT 2005 | james
Does anyone else encounter problems using feeders to handle caps that are reeled up with paper tape. We are having alot of problems with vendors that are now using the thicker type (like cardboard) to use to reel up caps. Our feeders either run too
Electronics Forum | Thu Sep 06 03:43:00 EDT 2018 | cmchoue
Dear Experts, Have any paper or data talking about the design guideline for avoiding BGA solder bridge? I desire to know the rule(guideline)that compare difference stencil thickness and safe solder design distance (air gap) can avoid bridge.
Electronics Forum | Mon Jun 21 12:08:17 EDT 1999 | C.K.
| I dug through my big box of office crap and found the disk with my technical papers. I posted the one on process control in the SMTNet library. It covers a lot of ground on what causes defects in the wave (too much or too little of something), an
Electronics Forum | Mon Jun 21 15:27:00 EDT 1999 | Tony
| I dug through my big box of office crap and found the disk with my technical papers. I posted the one on process control in the SMTNet library. It covers a lot of ground on what causes defects in the wave (too much or too little of something), an
Electronics Forum | Wed Oct 26 10:21:28 EDT 2005 | russ
We are also experiencing problems with this thick stiff paper tape. Our problem is the strength of the spring that supports the tape at its pick position. After a while it just pushes it down because the tape exit wants to bend the tape too sharply
Electronics Forum | Thu Sep 06 22:49:35 EDT 2018 | cmchoue
Dear davef, All of this are takling about how to improve release solder paste, Area ratio, aspect ratio...etc, but i want to learn the "When design BGA stencil which the safe air gap between solder paste in difference stencil thickness", this can he
Electronics Forum | Fri Sep 07 04:19:59 EDT 2018 | spoiltforchoice
You have lost me, its a stencil, you can change the aperture size, you can change the thickness and you can change the walls of the aperture. And all of those things will be in the papers anyone can find with a google. I have no clue what safe air g
