Electronics Forum: part and data and bga (Page 4 of 13)

BGA's and the Fuji IP2

Electronics Forum | Fri Jul 12 12:04:51 EDT 2002 | jax

The Lizard Tongue is just a thin metal strip that, when actuated, slides over the BGA component and holds it down during transport. If you contact FUJI, they should be able to give you a part number, and install instructions..... maybe even the real

Tray Parts and Velcro Straps

Electronics Forum | Wed Nov 06 12:52:24 EST 2002 | Chris Lampron

Hello Everyone, I have been noticing a trend. Many tray packaged parts are now being supplied with velcro straps to secure the trays. Am I wrong in thinking that this is a major source of static electricity? All of these components are BGA, QFP, TSOP

Re: solder balls and flux

Electronics Forum | Tue Feb 29 21:53:46 EST 2000 | Kelvin Chow

Dear Robert, On PBGA assembly, BGA sphere shrinkage number depends to the following factors, a. BGA Sphere size (before reflow) b. Solder mask opening diameter As far as I know, no formular has been established yet. Most of my friends just collect

Re: solder balls and flux

Electronics Forum | Tue Feb 29 21:53:46 EST 2000 | Kelvin Chow

Dear Robert, On PBGA assembly, BGA sphere shrinkage number depends to the following factors, a. BGA Sphere size (before reflow) b. Solder mask opening diameter As far as I know, no formular has been established yet. Most of my friends just collect

Mydata TP9-2 and TP11-UFP difference

Electronics Forum | Thu Jul 18 04:06:26 EDT 2019 | artem

Thanks for the info. And what about accuracy of the placement. Are both machines able to handle the same parts or are there any differences like for small components or BGA?

wave soldering and solder bridge

Electronics Forum | Mon Dec 17 11:55:08 EST 2007 | chef

I recently had the same problems, solder bridges on every thing I made, different customers boards, etc. I wave with no-clean flux. As I sorted out problems (pin holes, blow holes, splatter, etc.) I found a lot of variable factors. I changed flux,

CSP and BGA soldering difference.

Electronics Forum | Thu Apr 05 08:44:45 EDT 2007 | ck_the_flip

"Guest" is right, actually. CSP's are essentially BGA's, but typically the pitch and ball diameters are much smaller and in some cases, the pads of the CSP's can not be screen printed. If that's the case, you'd have to have flux-dip capabilities on

First Off and P+P Data

Electronics Forum | Wed May 25 17:58:07 EDT 2011 | rssimmons

The SimmScope is a first article inspection system that uses an overhead digital microsope on a motorized gantry to inspect the board - much like an AOI - except that it does not automatically make the pass/fail decisions. It is up to the operator to

Mydata TP9-2 and TP11-UFP difference

Electronics Forum | Thu Jul 18 17:41:31 EDT 2019 | rgduval

The UFP was a designation for "ultra-fine-pitch"; but, for the most part, you should be able to get the same placements out of both machines. Anything 0402 or above can be mechanically centered. The UFP machine will lean on optical centering for .5

Re: Buying stenciling and pick and place equipement.

Electronics Forum | Mon Dec 20 13:39:08 EST 1999 | Wolfgang Busko

Hi Clarissa, seems to be a real start up situation you are in. For the printing there is IMO no need to buy any sophisticated automatic-vision-alignment-self-cleaning-inline-and-more-machine. Features you need: - adjustable in X-,Y-,Z-axis (individu


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