Electronics Forum | Tue Mar 27 09:06:10 EST 2001 | dblsixes
We have tried to adjust the upper and lower heaters. We have a dillema in this area however. The power supply portion of the assembly has thermal vias in the solder pads underneath larger pads. We have a problem with solder wicking through these h
Electronics Forum | Sat Jan 23 16:31:09 EST 1999 | Steve Gregory
| Hi Everyone, | We plan to build, for reliability/experimental/research purpose some CSPs (namely Tessera microBGA 46-I/O 0/75mm pitch and TI 64 I/O 0/8 mm pitch). the various factors that we plan to evaluate are the reliability and assembly concern
Electronics Forum | Sat Jan 23 17:00:44 EST 1999 | Earl Moon
| | Hi Everyone, | | We plan to build, for reliability/experimental/research purpose some CSPs (namely Tessera microBGA 46-I/O 0/75mm pitch and TI 64 I/O 0/8 mm pitch). the various factors that we plan to evaluate are the reliability and assembly con
Electronics Forum | Tue Aug 23 03:29:37 EDT 2022 | samhe
I received a buck-boost DCDC board with an optical sensor from NextPCB, so I mounted the components and measured the efficiency. Table of contents Board received from NextPCB Solder paste printing Mounting of parts Reflow operation check Attaching
Electronics Forum | Mon Jan 11 14:48:44 EST 2010 | davef
SR1000 is commonly used for tenting. Search the fine SMTnet Archives on : tenting Someone gave us this note. We have lost their name. It seems to be good advice. If Liquid Photo Image (LPI) solder mask is required, do not tent via holes. Tenting
Electronics Forum | Fri Dec 17 14:30:42 EST 2004 | Dreamsniper
I goy this issue: Voids in almost every ball of my BGA's prcessed since we changed our BGA via tenting to double tenting. The tenting is done with a dry film application to fill the via from the solder side then apply LPI Mask on the surface of the
Electronics Forum | Fri Dec 17 14:31:52 EST 2004 | Dreamsniper
I got this issue: Voids in almost every ball of my BGA's processed since we changed our BGA via tenting to double tenting. The tenting is done with a dry film application to fill the via from the solder side then apply LPI Mask on the surface of the
Electronics Forum | Thu Aug 25 10:17:48 EDT 2005 | davef
Send the pic to dave5252 at hotmail.com [you can't send pic through the SMTnet email thing] For more on via plugging, tenting, capping ... look here: http://www.merix.com/technology.php?section=processes&page=pdf/Via_Fill_Plug.pdf Something, a voi
Electronics Forum | Fri Feb 22 16:49:44 EST 2008 | pms
Steve, Trying to keep wave solder from coming up the via' from the bottom and adhering to the via's and via's pads during wave. We use WS flux thru-out the whole process. I have been concerned about possible flux intrapment in the via's. That's a g
Electronics Forum | Thu Feb 07 20:53:51 EST 2002 | davef
Regardless of the technique used for the mounting pad shape or definition, isolation of the plated through hole [PTH] from the mounting pad is important. If the PTH is contained within the mounting pad, solder will wick down the PTH. The amount of
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