Electronics Forum | Tue Jun 01 05:17:16 EDT 2004 | Alistair MacAdam
I am currently looking at the volume of paste being deposited on a PWB 2.4mm thick with a 0.25mm tolerance. I am looking for information on PWB variation and a MPM AP25 series printer, and can the volume of paste be controlled on varing PWB thickness
Electronics Forum | Mon Aug 16 13:38:35 EDT 2010 | rl
i would like to request some advice on manually dispensing paste for super fine pitch components. first some background. i am a small design house and specialize in sub-miniature prototypes for avionics. so far, i have mostly used stainless steel st
Electronics Forum | Wed Apr 10 22:46:04 EDT 2002 | davef
On SMTnet, we've discussed the the frailties of controlling paste height, when volume is a more telling measure. Sometimes if you seperate too quickly, the paste tries to stay attached to the aperture walls. This creates a 'U' shaped deposit with r
Electronics Forum | Mon Jun 19 12:46:11 EDT 2023 | daniel_stanphill
And I can set deposits down to 34 um on our my500. I do not have the exact numbers in front of me on the my700 or Essemtec, but they will both be better than that.
Electronics Forum | Thu May 26 16:41:00 EDT 2011 | scottp
Here's what I do: - Test Surface Insulation Resistance (we're in the high reliability market and use a test significantly harder than IPC's). I also test SIR in combination with other assembly materials like conformal coatings and wave solder flux
Electronics Forum | Thu May 26 13:28:12 EDT 2011 | blnorman
I agree with Dave on the processing issues, but there are others: Print speed capability (do you get good deposits at various print speeds), humidity exposure (our plant did get to the high side so moisture absorption on the board/stencil was an issu
Electronics Forum | Tue Jun 01 12:48:49 EDT 2004 | pjc
AP25 can handle warped boards to a degree. I also depends on the board clamping system on the machine. There are three avbl. First is Universal Vacuum box, second is dedicated tooling with vacuum and third is Y Snugger tooling that does not use vacuu
Electronics Forum | Thu May 26 08:52:42 EDT 2011 | davef
Phil Zarrow wrote a useful paper that could help in evaluating paste. Here read it ... Evaluating Solder Paste � Not An Option Contributed by Phil Zarrow of ITM an Independent SMT consulting firm With soldering being the dominant source of assembly
Electronics Forum | Tue Jun 01 07:26:55 EDT 2004 | johnwnz
Alistair, your paste deposit is controlled by a few things: Stencil thickness Squeegee pressure Squeegee speed Print gap in 99 out of 100 applications for paste printing you would have a print gap of 0 i.e. on contact printing where the PCB is in fu
Electronics Forum | Fri Aug 18 05:43:51 EDT 2000 | Richard Berry
Thanks Wolfgang / Charles Have tried method suggested by Wolfgang on one product, and seem to be a bit over (perhaps density calculation was a bit out). Also, the volume of paste deposited must be less than the voume of the apetures on the stencil b
