Electronics Forum | Thu May 06 10:52:08 EDT 2004 | John S
Many component manufacturers are moving to Pb free terminations. I've been doing a literature study of Pb free processing and have found several articles that indicate Pb-free paste with Sn/Pb terminations leads to early fatigue failures. Does anyo
Electronics Forum | Thu May 13 16:55:51 EDT 2021 | emeto
With Pb-Free HASL you can't use Pb process for sure as the melting point of tin is so much higher than the lead paste process. SAC305 is the most popular compound, unless your assembly requires something else for a specific reason.
Electronics Forum | Wed May 07 10:15:46 EDT 2008 | llaerum
We are also having some issues with certain small parts. In our case this is tantalum caps and 0402 caps. We had a vendor admit after much discussion that the plating used from a particular orgin was different on the tantalums. The tehory is thatthsi
Electronics Forum | Mon Aug 11 15:57:18 EDT 2003 | Fred Matthews
As the traqnsistion to Pb free manufacturing gains speed and exposure the period between true Pb free solutions and the present is still somewhat distant. Are there any publications or documentation on the use of Pb free components and non-Pb free
Electronics Forum | Thu May 13 20:40:25 EDT 2021 | winston_one
Yes, we can't use pure Pb PROCESS. And as I say we will not use it anyway, as we have lead-free BGA's, LGAs, component with Solder Charged Terminations... It's became almost normal practice to solder it with leaded solder pastes. In this case peak re
Electronics Forum | Thu Aug 24 09:23:29 EDT 2000 | Dr. Ning-Cheng Lee
You are asking a very good question which has been an issue in the industry for a long long time. For operating at 225C, you will need a solder with melting point no lower than 270 or even 280C. HMP solder is very difficult to come by. At this stage,
Electronics Forum | Wed Aug 21 17:44:32 EDT 2002 | davef
Splitting hairs, I expect SIR of all solderability protection, including OSP, to decrease after reflow. What�s more, I expect the SIR of all solderability protection to pretty much decrease over time. The �comb pattern� test specimens meet requirem
Electronics Forum | Fri May 14 14:46:56 EDT 2021 | emeto
Not following the lead paste process window has a whole set of risks for joints quality and reliability.
Electronics Forum | Thu May 20 03:45:22 EDT 2021 | jineshjpr
SAC305 Will be the best choice with minimum TAL, Maximum Soak Solder Profile. Surely your solder Joint strength also will be more reliable & This can pass any kind of reliable Tests.
Electronics Forum | Thu May 13 09:52:34 EDT 2021 | winston_one
Want to update this question a little, I know it appears few years ago, but I hope there is some updates... We have to assembly few samples of motherboards with this kind of finish (customer mistake during pcb order). Normally we can use leaded sold
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