Electronics Forum | Thu Sep 24 12:59:59 EDT 2020 | davef
If whatever is preventing the leads on your component from wetting is oxidation, cleaning the component will not help. Consider trying a more active flux prior to soldering. Understand from your supplier the potential complications that may affect
Electronics Forum | Tue Jan 30 15:21:45 EST 2001 | dason_c
You can also check Alpha Metals web site for some information. http://www.alphametals.com/products/pin-in-pasteprocess.html Rgds. Dason
Electronics Forum | Wed Jan 31 01:41:00 EST 2001 | pjc
Steve, I have no influence over conn design. We paste print-reflow solder two types of connectors. One is a 50 pin IDC w/ 0.5mm lead dia @ 2.54mm lead pitch and a chamfered pointed lead tip. The other is 32 pin DIP w/ 0.36mm lead dia @ 2.54mm pitch
Electronics Forum | Tue Oct 17 03:13:10 EDT 2006 | charless
Apoligies Steve if I did not explain myself clearly. We have made the same design using the same RoHs compliant components (which I am assured by the suppliers are process temperature capable) with both lead and lead free solder. Without wishing to
Electronics Forum | Fri Jan 21 13:27:38 EST 2011 | mosborne1
Try baking your boards first to remove the moisture. Moisture and boards that have not been drilled properly will cause pin hole or blow holes in PTH. Also take a look the surface of the pads before printing. You maybe contaminating the surfaces of t
Electronics Forum | Wed Oct 21 08:06:06 EDT 2009 | scottp
I agree with Dave. If the device has a lot of power we'll put thermal vias between the solder deposits with annular rings of soldermask to keep solder out of the holes. We've never had to mess with placement pressure. We've been using QFNs for yea
Electronics Forum | Tue Mar 27 09:06:10 EST 2001 | dblsixes
We have tried to adjust the upper and lower heaters. We have a dillema in this area however. The power supply portion of the assembly has thermal vias in the solder pads underneath larger pads. We have a problem with solder wicking through these h
Electronics Forum | Wed Jul 29 17:39:40 EDT 1998 | David Spilker
| Hello everybody. | Remember I posted some questions on the smtnet regarding placing the thru hole connector using paste and reflow(pin in hole). I have able to accomplish the process succcesfully.....but I have a problem. The boards are failing at
Electronics Forum | Sun Jun 07 09:43:11 EDT 1998 | Bob Willis
There are some guidlines on design and through hole reflow on my web site to download. Also on pin in hole reflow the SMTA Office has a document on using the tecnology. | R&D is currently designing a board with smt components on both sides of the bo
Electronics Forum | Tue Jul 28 16:13:45 EDT 1998 | Steve Gregory
| Hello everybody. | Remember I posted some questions on the smtnet regarding placing the thru hole connector using paste and reflow(pin in hole). I have able to accomplish the process succcesfully.....but I have a problem. The boards are failing at
