Electronics Forum: pins and in and paste (Page 4 of 6)

Leaded and Lead-Free products in single SMT line

Electronics Forum | Thu Sep 01 02:51:31 EDT 2011 | zedor

HI, We currently have two SMT lines, one running leaded products and the other lead-free. There is a recommendation to combine the two to increase the line capacity. What do you think are the pros and cons, is there a risk in contamination ot the

SOD323 and SC90 bounceing parts in final PNP stages.

Electronics Forum | Mon Mar 05 17:54:07 EST 2012 | swag

Three ideas for you: 1) Make sure nozzle tips are clean. 2) Check coplanarity of leads to bottom of body. If leads are above body, it could be the are not contacting paste well. 3) Investigate static charge in the parts caused by the feeder or

Lead-free and Leaded solder in the same reflow

Electronics Forum | Wed Feb 01 03:38:56 EST 2006 | Jose Luis

Hi all, I'm working in Military Production and then, We have an exception about RoHS (LEAD FREE), but, because we use "normal" components, in this moments, a lot of components have LEAD FREE terminations, and we think that after of 1st July, we wo'nt

"Gap" in completed solder joint between lead and pad

Electronics Forum | Tue Nov 28 15:10:50 EST 2006 | M. Sanders

Unfortunately, I don't have a copy of IPC-A-610 D on hand, however, I believe in IPC-610, this �floating height� between lead and pad has no maximum specification restriction. As long as there is no voiding, it is still acceptable for all 3 classes.

"Gap" in completed solder joint between lead and pad

Electronics Forum | Wed Nov 29 10:10:50 EST 2006 | M. Sanders

I'm sorry, Dave - I didn't make myself very clear. Yes, this space (not really a "gap") is filled with solid solder. For instance, if you place a gull-wing component in solder paste, after reflow, there will probably be a thin film of solidied solder

Fluxes and Fluxers - the info is in the library

Electronics Forum | Mon Apr 26 16:06:32 EDT 1999 | Chrys Shea

Hey - remember the evaluation of VOC-Free fluxes that I promised a couple of months ago? well, I finally scrounged up the time to remove the propreitary (board name and number) info from the report. So it's ready. I posted it in the SMTnet library

High Relative Humidity and Blistering Issues in Assembly

Electronics Forum | Sun Sep 07 20:51:52 EDT 2014 | natashakt

1. Is the high RH environment consistently at 72% RH and 21.4 degrees Celsius? No, over the past 2 weeks I have recorded the highest at the moment: 67% RH at 22.6 degrees C and lowest (it is Spring not summer yet): 31.9% RH at 19.0 degrees C. Or d

CCGA - Stencil design and Reflow Profiling

Electronics Forum | Thu Aug 22 22:19:13 EDT 2019 | sssamw

From the picture you present, it is a pin in paste part with pin length 2.2mm (a good length for 1.6mm PCB thickness), and seems the pin tilted and touch on PCB surface, thus causes up-part. Sorry I cannot image pin tilted not before placement but i

Re: BGAs and vapor phase

Electronics Forum | Mon Jul 19 12:37:15 EDT 1999 | Wolfgang Busko

| | | | | Hi, SMTASSY | | | | that�s what we do, soldering our double-sided-finepitch-BGA-and all-the-other-stuff-boards in vapourphase because it�s the only thing we have. | | First, we do not do real series produktion, only prototyping up to som

Re: BGAs and vapor phase

Electronics Forum | Tue Jul 20 05:29:14 EDT 1999 | Wolfgang Busko

| | | | | | | | Hi, SMTASSY | | | | | | that�s what we do, soldering our double-sided-finepitch-BGA-and all-the-other-stuff-boards in vapourphase because it�s the only thing we have. | | | First, we do not do real series produktion, only prototypi


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