Electronics Forum | Fri Aug 19 02:16:40 EDT 2011 | ppcbs
In my opinion destructive methods went out with the stone age. At least they did at our company. We specialize in non-destructive defect analysis. We can determine where the failure is i.e. assembly process, fab defect, BGA defect or plating proce
Electronics Forum | Wed Jun 24 16:23:29 EDT 1998 | Justin Medernach
| Has anyone had experience with placing BGA on gold plated boards. I thought I read a while ago there was a problem with embrittlment causing cracked joints. If anyone has experience with this your feedback would be great. | Mike Mike, Your concer
Electronics Forum | Thu Jun 25 09:53:04 EDT 1998 | Earl Moon
| | Has anyone had experience with placing BGA on gold plated boards. I thought I read a while ago there was a problem with embrittlment causing cracked joints. If anyone has experience with this your feedback would be great. | | Mike | Mike, | You
Electronics Forum | Fri Jun 19 10:03:46 EDT 1998 | Earl Moon
| Has anyone had experience with placing BGA on gold plated boards. I thought I read a while ago there was a problem with embrittlment causing cracked joints. If anyone has experience with this your feedback would be great. | Mike Mike, We and ind
Electronics Forum | Fri Aug 28 23:32:39 EDT 1998 | Pete Sorenson
| Does anyone have any experience they are willing to share on Ag epoxy used as a copper through hole plating replacement? Was CEM3 used? | What are the limitations? | Thanks, | Steve I have used silver epoxy extensively for conductive bonding applic
Electronics Forum | Thu Aug 27 17:40:11 EDT 1998 | Earl Moon
| Does anyone have any experience they are willing to share on Ag epoxy used as a copper through hole plating replacement? Was CEM3 used? | What are the limitations? | Thanks, | Steve Steve, Hello again. Hope you guys (Intel) aren't going to do that
Electronics Forum | Mon Oct 19 15:43:37 EDT 2009 | dilogic
We have a problem with QFN IC's with NiPdAu plated pads. Our ULC's don't see the pads due to the almost ideal reflection. Vision sees the pads almost black. As we don't have OAL-cameras (which can help in this case, I assume), I am thinking of back-l
Electronics Forum | Mon Apr 09 10:16:14 EDT 2007 | davef
Pick and place: * Fuji: The largest pcb size is 20" by 18" for pick and place; 18"x14" for chip shooters. Fuji NP XL series allows 27 by 23 inch boards using a conveyor. * MYDATA has machines that can be configured to 34" X 44" X 0.500" * HSP 4796A a
Electronics Forum | Mon Dec 20 13:39:08 EST 1999 | Wolfgang Busko
Hi Clarissa, seems to be a real start up situation you are in. For the printing there is IMO no need to buy any sophisticated automatic-vision-alignment-self-cleaning-inline-and-more-machine. Features you need: - adjustable in X-,Y-,Z-axis (individu
Electronics Forum | Tue Nov 01 14:46:31 EDT 2011 | davef
Agilent TestJet Technology White Paper In the early 1990s, the testing of digital parts became problematical. Previous in-circuit test techniques sought to ensure a correct, functioning part by applying digital patterns, called vectors, to the input
