Electronics Forum | Mon Mar 06 17:17:13 EST 2000 | gary
I need a little help with RF and Rogers 4003 board material. My background was in digital and now I need to set up a new line to make small RF products (.5" x .5" or smaller). I want to find out about board platings, finishes/maskings and reasonable
Electronics Forum | Wed Mar 05 03:43:58 EST 2003 | testing
Hi, Mike Thanks for the reply With your oracle system were you able to perfom SPC analysis? and if possible do you have any Material that may be helpful for me to get my system setup i.e. whether through Excel, Access, Oracle etc. + What are your
Electronics Forum | Mon Apr 25 22:56:44 EDT 2005 | davef
rush316 First, no one stated that PBB and/or PCBE are in FR4. FR4 contain tetra-bromo-bisphenol A [TBBA]. Second, there are classes [and grades] of dielectric materials used in fabricating printed circuit boards. Grades, NEMA LI-1. From these gr
Electronics Forum | Wed Mar 05 12:23:31 EST 2003 | msivigny
Hello Phil, We did use an Oracle relational database with an Access front end to input and query data from the system for reports. We did not perform SPC with the Oracle dB. As the whole data collection process was completely customized, we hadn't im
Electronics Forum | Fri Mar 11 18:47:54 EST 2005 | davef
JD: It's important to note that FR-4 does not contain PBB or PBDE. The bromine in FR-4 epoxy comes in the form of tetra-bromo-bisphenol A [TBBA], which polymerizes and become part of the cross-linked epoxy. Bromine, in the form of hydrogen bromide, i
Electronics Forum | Fri Jul 15 13:28:55 EDT 2005 | Brian
A process consists of much more than just thee machine. When developing a cause and effect diagram ffor the process, there are many parameters that fall outside the machine itself. There are Man, Machine, Methods, and Materials. Just monitoring th
Electronics Forum | Tue Feb 29 10:14:02 EST 2000 | Robert Hartmann
My company is just getting into the flip chip packaging arena. We are putting in a prototype/small volume wire bond PBGA line. We have some questions with regard to choosing solder balls and cleaning of flux. 1) Is there a formula for the shrink
Electronics Forum | Fri Jul 28 14:34:13 EDT 2000 | Gary Simbulan
Belive it or not, these boards were run through a Centech batch mode Vapor Phase machine. Single stage top side IR preheat. Vapor temp 218 C. Solder paste is an SN62 RMA.The boards were FR4 8 layer w/ solder mask, fairly conventional as might be e
Electronics Forum | Tue Feb 29 10:14:02 EST 2000 | Robert Hartmann
My company is just getting into the flip chip packaging arena. We are putting in a prototype/small volume wire bond PBGA line. We have some questions with regard to choosing solder balls and cleaning of flux. 1) Is there a formula for the shrink
Electronics Forum | Thu Feb 22 04:00:02 EST 2001 | Scott B
We are increasingly being asked to store components for longer and longer periods which we know through experience leads to reduction or total loss of solderability of the parts. 1) What is the industry accepted shelf life of tin/lead plated compone
