Industry News | 2009-03-10 17:53:29.0
Londonderry, New Hampshire, USA � Cobar Solder Products will exhibit a complete range of advanced soldering materials ranging from bar solder to SMT solder paste to high-performance fluxes at Apex 2009, in booth#2111.
Industry News | 2008-10-07 21:14:49.0
GREELEY, CO � October 2008 � FCT Solder, a division of FCT Assembly and an authorized Licensee of Nihon Superior Co. Ltd.'s SN100C product line, announces that it will showcase its line of SN100C products and technologies with Nihon Superior Co. Ltd. in booth 402 at the upcoming Mexitr�nica exhibition scheduled to take place October 21-23, 2008 at the Expo Guadalajara, Hotel Hilton, in Guadalajara, Jalisco, Mexico.
Industry News | 2008-09-12 01:24:36.0
GREELEY, CO � September 2008 � FCT Solder, a division of FCT Assembly and an authorized Licensee of Nihon Superior Co. Ltd.'s SN100C product line, announces that it will showcase its line of SN100C products and technologies with Nihon Superior Co. Ltd. in booth 401 at the upcoming IPC Midwest exhibition and conference, scheduled to take place September 24�25, 2008 at the Renaissance Schaumburg Hotel & Convention Center.
Industry News | 2015-08-26 18:25:32.0
Nihon Superior Co. will exhibit in Booth #419 at SMTA International, scheduled to take place Sep. 27 - Oct. 1, 2015 at the Donald Stephens Convention Center in Rosemont, IL. This year, Nihon Superior will celebrate its 50th anniversary since first introducing joining materials to the market. The most well-known solder; SN100C® has seen its 15th anniversary and its usage is still expanding. The reliability of SN100C has been proven in a wide range of electronics assembly products. The SN100C alloy delivers a silver-free stable microstructure that can accommodate the long-term and impact strains to which a solder joint can be subjected. The eutectic character of the SN100C alloy and the associated high fluidity provides faster wetting and increased spreadability over SAC305, which is beneficial in wave soldering and hand soldering applications as well as in reflow.
Industry News | 2011-07-13 15:26:19.0
The Balver Zinn Group announces that Cobar Solder Products Inc. will exhibit its lead-free SN100C-XF3+ solder paste and wire at the upcoming SMTA Ohio Valley Expo & Tech Forum, scheduled to take place Thursday, July 14, 2011 at the Doubletree Hotel in Cleveland, OH.
Industry News | 2013-10-08 14:47:36.0
The Balver Zinn Group announces that it will exhibit in Hall A4, Stand 451 at the 20th international Productronica Trade Fair, scheduled to take place November 12 - 15, 2013 at the New Munich Trade Fair Centre in Munich, Germany.
Industry News | 2009-09-18 09:44:06.0
September 2009 — The Balver Zinn Group announces that Cobar Solder Products will exhibit a complete range of advanced soldering materials ranging from bar solder to SMT solder paste to high-performance fluxes in booth 722 at the upcoming SMTA International, scheduled to take place October 6-7, 2009 at The Town and Country Resort and Convention Center in San Diego.
Industry News | 2012-03-28 15:59:44.0
Nihon Superior Shanghai Co. Ltd., a subsidiary of Nihon Superior Co. Ltd. will showcase a new and expanded range of products based on its SN100C® silver-free, lead-free solder at the upcoming NEPCON China 2012 exhibition in Shanghai.
Industry News | 2017-08-10 17:43:56.0
Nihon Superior Co. announces its Nihon Superior Shanghai subsidiary will exhibit in Booth #1G08 at NEPCON South China, scheduled to take place August 29-31, 2017 at the Shenzhen Convention & Exhibition Center. The reliability of SN100C has been proven in a wide range of electronics assembly products. The eutectic character of the silver-free SN100C alloy and the associated high fluidity provides faster wetting and increased spreadability over SAC305.
Industry News | 2008-01-31 00:10:18.0
GREELEY, CO � January 29, 2008 � FCT Solder, a division of FCT Assembly, and Nihon Superior USA, a subsidiary of Nihon Superior Co. Ltd., announce that it will exhibit SN100C� Lead-Free products paste in booth 213 at the upcoming IPC International Conference on Flexible Circuits, scheduled to take place February 12-14, 2008 in Phoenix, Ariz.
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