Electronics Forum | Thu Oct 17 14:36:30 EDT 2013 | hegemon
Hey SWAG, any idea where that Nano Protek goes, that you have to replace it? (and I am not talking about polishing up wheels) Is it being scrubbed off of the stencil during the print process, and over time it must be replenished? Sorry a bit off top
Electronics Forum | Wed Mar 04 21:24:04 EST 1998 | Ron Costa
Hello everyone! Does any know anything about bare board size variations? Is there a spec. or tolerance? I'm running small lots of boards and during the screen printing process I find that I cannot paste each board perfectly.I've tried other screen pr
Electronics Forum | Tue Mar 18 11:52:38 EDT 2008 | rrpowers
A couple years back we were looking at going to an enclosed solder paste printing process, similar to the ProFlow, Crossflow, or Rheometric Pump. We have older MPM AP25's with a custom transport. Speedline told us that in order to add the RheoPump,
Electronics Forum | Fri Jul 29 08:22:34 EDT 2011 | mskler
What will be the specifications of solder paste printing for 6 mil thikness in SnPbAg process. Also what will be the control limits fro X bar R chart. Thanks in advance for the help
Electronics Forum | Thu Aug 19 12:01:26 EDT 2004 | erhard
We want to get a process running to print paste with a thicker plastic stencil with some room left underneath for preassembled components. I know DEK offers these stencils but since we are using an MPM printer they don't want to sell to us stencils f
Electronics Forum | Mon Mar 03 09:16:09 EST 2003 | msivigny
Hello martys, The critical variables to measure print process capability on any printer are its ability to securely clamp a board, accurately align the board to its mating stencil, print with appropriate squeegee pressure and follow print material gu
Electronics Forum | Thu Aug 19 15:49:05 EDT 2004 | pjc
Hi Erhard, Go to http://www.globalstencil.com They are the stencil firm that worked with MPM for developing technology for printing with thick stencils that are milled out on the bottom to account for existing components on the top side of a PC boa
Electronics Forum | Thu Jun 12 04:22:00 EDT 2003 | gaoliangcheng
Hi, our factory is introducing the FPC process. I have some question to ask.Could anyone reply/ 1.how can we fix the FPC in the mounting and printing process? 2.how can we set up the temperature profile? Thanks.
Electronics Forum | Tue Mar 18 13:18:04 EDT 2008 | realchunks
I guess one question is why go to this system? Not because it's out dated, but why do you feel the need to go with this type of process?
Electronics Forum | Fri Oct 18 09:27:53 EDT 2013 | dontfeedphils
I believe it's mostly worn off through cleaning solvents and the slight abrasion during the under stencil cleaning process. I couldn't say whether or not it's ever in a state that would allow it to transfer to the PCB though.
