Electronics Forum | Wed Apr 09 23:37:52 EDT 2003 | MA/NY DDave
Hi I know what DaveF is saying about the Kapton situation, yet from what I remember also at a KIC presentation the Kapton technique wasn't given as bad a billing as Dave describes. You do have to make sure you get a good firm contact and verify it
Electronics Forum | Mon Jun 01 04:35:16 EDT 2015 | buckcho
Hello, I have seen two different ways in two companies - one they do it before start of every batch, the others do it when a program is made. I am a fan of the first one, but it depends on company policy. Its good when you have to make a lot of chang
Electronics Forum | Tue Feb 25 11:03:51 EST 2020 | joeljacobo
Hello everybody, you see, I have a problem with the placement of these RFI SHIELD CLIPs (PN: S0941-46R) I simply cannot place them using the machine, so far I have placed them by hand in the prototypes but I am about to start production and I need
Electronics Forum | Wed Dec 07 13:10:32 EST 2011 | conjugate
Hi Reese, the contamination is coming from the material of the PCB itself. Basically, there`re failure observed in the products from electronics factory. preliminary analysis been done, the main board not properly functioning due to bad solder. next
Electronics Forum | Mon Jan 11 04:42:38 EST 2016 | buckcho
You can do the so called "Golden Sample" with defects from the process. The making of the defects on the board is very important to be as much close to the real ones from the production. How I do it - after the printer I remove paste on some pads, so
Electronics Forum | Wed Nov 20 21:04:15 EST 2002 | yngwie
Hi Dave, What do you mean by "if the board is manufactured properly". If the board is not manufactured properly, humidity will have an impact on the peel strength? Is that what you mean. How does the Humidity impacted the peel strength ? Thru' which
Electronics Forum | Tue Dec 23 11:55:37 EST 2003 | Marc Simmel
Details, details: 1) The metal shell is part of the component body. The base metal is austenitic stainless steel (304) that has been plated with 90/10 tin-lead over nickel (semi-bright). 2) The entire part (leads and shell) is elevated by the mass o
Electronics Forum | Mon Jan 24 22:28:57 EST 2005 | davef
In addition to the potential problems you mentioned, add: * Barrel cracking of PTH and via. * Lifted pads. * Warped boards. And the reason you're not using a solder fountain to to solder this connector is? Or use an old trick we've done here on SMT
Electronics Forum | Mon May 16 11:45:35 EDT 2005 | PWH
Agree with PDE. We have two GSM's and we get this error often. Palm down e-stop when you get this error message. Machine will drop nozzle bank down after doing some segment repairs. Open covers and make sure nozzles are seated in reference to ali
Electronics Forum | Thu Jul 07 04:34:19 EDT 2005 | Lloyd
This problem exists at a very low level but happens on all our discrete components, all our products and in two plants. Between the PCB land and the component termination there is a barrier of flux residue, this actually lifts the component slightly