Electronics Forum: pure (Page 4 of 26)

Electro-Deionization Systems

Electronics Forum | Thu Sep 11 12:40:21 EDT 2008 | slthomas

You might try looking here: http://www.pure-aqua.com/edi-series.htm and then get back to us on what you find out. It looks interesting and expensive. :)

Solder paste dispenser choice

Electronics Forum | Fri Oct 24 13:28:46 EDT 2008 | evtimov

Hi, In your case definitely go with a pure time/pressure. If you want to make repeatable small dots later - only Archimedian screw. Another way is jet printing technology, which I assume is very expensive and far away from your case. Regards, Emil

Tin Mitigation Processes

Electronics Forum | Mon Apr 30 17:43:53 EDT 2012 | scottv02

I have heard there is a process for mitigating the pure tin issues for 0402/0201 size parts by the use of SN63/PB37 solder print process. Is this true and does anyone have the data to back this up?

Machine ICOM 5000

Electronics Forum | Wed Dec 05 23:31:12 EST 2012 | aqueous

This is a (Resistivity of Solvent Extract (ROSE) tester. Per IPC standards, ROSE testers use a test solution comprised of 75% IPA (99% pure) and 25% DI water. -Mike Konrad Aqueous Technologies www.aqueoustech.com konrad@aqueoustech.com

Profiling for Pb-free HASL

Electronics Forum | Fri Jun 21 13:41:48 EDT 2019 | slthomas

Another question - how would you classify a "pure tin" (supplier term, not mine) alloy with .12% Ni specified? is this a common Pb-free HASL alloy?

What should be the ideal Purity level of incoming Nitrogen for SMT

Electronics Forum | Fri Aug 16 12:39:51 EDT 2019 | spitkis2

Liquid nitrogen that we get in 230 liter tanks is 99.9995% pure N2.

Re: Calcualtion of expected yeilds

Electronics Forum | Wed Jul 12 05:04:01 EDT 2000 | JohnW

Hi Guy's.... Was thinkng about i more this moning..in the shower actually...sometimes think I do my best work there!. So far I'm looking at stuff like integrating the DFM study to show thing's that are going to present production / process issues e

Board with immersion Tin

Electronics Forum | Mon Nov 25 09:06:15 EST 2002 | jax

You might want to check the tin thickness. I believe you have a minimum of .65 microns in order to achieve a good solder joint through 3 thermal passes. In an immersion tin process, the ability to solder is time and temperature dependant. As the int

Using Isopropyl alcohol as flux thinner

Electronics Forum | Mon Nov 12 18:08:37 EST 2007 | samir

That's when you give that "Supervisor" a tall glass of SHUT THE F*CK UP. I betcha you regret even mentioning it to him. I'd have just made up some techno-babble and switched it regardless. Told him something like - "pure IPA will act as a catlyst

Pick and Place Startup - LQPF100 bridging issues

Electronics Forum | Fri Mar 26 15:48:31 EDT 2021 | grahamcooper22

Leaded HASL on small pads can be quite difficult to print on...the HASL tends to be domed rather than flat..and that can affect print quality...you really need a perfectly flat pcb pad to print paste on when you are assembling 0.5mm QFPs. If the pcb


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