Electronics Forum: ran (Page 4 of 66)

What is a CHAMPAGNE Voiding?

Electronics Forum | Fri Dec 03 12:27:41 EST 2004 | mruzicka

I did a quick search and ran across this: www.nepcon.co.uk/files/pt_kbryant.pdf You can also look here http://listserv.ipc.org/scripts/wa.exe?A1=ind0411&L=technet post #32.

Surface mount Machines

Electronics Forum | Sun Jan 16 05:22:36 EST 2005 | dorklover664

I�ve worked as an SMT operator for 3 different companies. And have worked with six different types of pick and place machines. I can tell you what I know. The first place I worked at was high volume low mix and we ran Fuji�s. They are by far the best

Cpk For 0201 Placement

Electronics Forum | Sat Jan 29 23:55:58 EST 2005 | KEN

I recently ran a process evaluation (Print/ P&P /Reflow) and was plesently surprised with a 5.0 sigma process or 250ppm. Attrition was under 1%. Keep in mind this is defects counted Post-reflow. The most signifficant defect was tombstoning / draw-

Lead Free - SnAgCuIn???

Electronics Forum | Mon Feb 07 15:53:12 EST 2005 | John S

I ran across a description of a SnAgCuIn variant of lead free solder that melts around 195C. Has anyone used such an alloy? Is it widely available? I haven't seen it marketed widely. Thanks John S

CP6 Nozzle sticking

Electronics Forum | Tue Feb 15 08:33:52 EST 2005 | jdengler

I had a similar problem on another machine. It turned out to be the wrong oil used on the nozzle shaft. This oil was a higher viscosity, which caused the nozzles to stick at start-up. After the machine ran for a few minutes everything returned to

Via tenting/filling with BGAs

Electronics Forum | Wed Mar 23 22:28:10 EST 2005 | KEN

I ran into this yesterday. Seems some designer decided to not solder resist the via's on the solder side. Then the assembly went over the wave solder in a universal fixture. Not an ideal situation.

NanoStar

Electronics Forum | Tue May 03 15:15:33 EDT 2005 | dphilbrick

The biggest problem is getting paste on the board. We ran a board that had 8 per and would get an occasional insufficient solder joint. I would look into doing the boards with something like a SiPad process (www.sipad.net) My $0.02

Poor reflow over gold plating

Electronics Forum | Fri Jul 08 06:38:51 EDT 2005 | mattkehoe

I did not get that info. We sent them back and the vendor ran them through HASL finish. They processed very well after that. Thanks to everyone for the help. mk

Nicolet X-ray service

Electronics Forum | Thu Aug 04 15:21:41 EDT 2005 | vikkaraja

What kind of problems are you having? We had our shares with CXI 3600. If there is something I have ran across maybe I can help.

Solder voids on QFN Packaging

Electronics Forum | Sat Apr 15 14:28:26 EDT 2006 | Dan Mendoza

This may sound like advertasing, but I ran a DOE with five solder paste/flux manufacturers and somehow, the voids went away with the AIM solder.


ran searches for Companies, Equipment, Machines, Suppliers & Information

High Throughput Reflow Oven

Nozzles, Feeders, Spare Parts - Siemens, Fuji, Juki, Yamaha, etc...
Blackfox IPC Training & Certification

Easily dispense fine pitch components with ±25µm positioning accuracy.
Equipment Auction - Eagle Comtronics: Low-Use Electronic Assembly & Machining Facility 2019 Europlacer iineo + Placement Machine  Test & Inspection: Agilent | Tektronix | Mantis Machine Shop: Haas VF3 | Haas SL-20 | Mult. Lathes

Wave Soldering 101 Training Course
Equipment Auction - Eagle Comtronics: Low-Use Electronic Assembly & Machining Facility 2019 Europlacer iineo + Placement Machine  Test & Inspection: Agilent | Tektronix | Mantis Machine Shop: Haas VF3 | Haas SL-20 | Mult. Lathes

Best Reflow Oven