Electronics Forum: rbs and 35 (Page 4 of 21)

CCGA and overprinting?

Electronics Forum | Mon Oct 15 10:51:49 EDT 2001 | davef

On over printing, the general issues are: * Paste deposits being so large that when reflowing, collapse onto many, rather than a single solder mass. * Paste expanding during heating and being close to other solder deposits and bridging [as you say].

COB and Plating

Electronics Forum | Tue Oct 07 12:35:10 EDT 2008 | andy_pal

Hi All, I am using COB on my DOUBLE SIDED PCB. lastly we used Eletrolytic Ni / Flash Gold Plating. Our Boards vias Failed the UL corrosion Test. we did some cross-section analysis and found 10.75 �m of Nickel and 0.022 um of Gold and as the Process

SMT Processing and gasketing

Electronics Forum | Tue Nov 11 17:35:08 EST 2008 | davef

SM-840, is a material qualification document only, with all the test requirements applicable only to a defined test coupon, not to production boards. So, it's useless for what you're trying to accomplish. As assemblers use A-610 - Acceptability Of E

Flux Designations and Composition

Electronics Forum | Mon Jul 12 11:35:27 EDT 2004 | Pierre RICHARD

Here are some answers to my questions after a good research. I also added more definitions that could help understand this esoteric language used in assembly, specially surrounding fluxes and their use. In blue italics are comments and extracts from

BGA ball and PCB pad

Electronics Forum | Thu Feb 12 11:35:17 EST 2004 | Kris

what is the composition of the paste and ball ? Interesting to know why the customer is asking you to look for it Thx

CSP and BGA soldering difference.

Electronics Forum | Sat Apr 07 00:41:35 EDT 2007 | Haris

Thank you all for giving me good knowledge.

seperation of soldermask and pcb

Electronics Forum | Tue Mar 25 09:35:28 EDT 2014 | emeto

Have you tried to bake the boards before you process them?

mpm125 manual operation and datasheet

Electronics Forum | Wed Sep 22 01:35:27 EDT 2021 | david0811

hi, i looking for MPM125 manual operation and also datasheet. please assist

Time and temp in lead and lead-free reflow

Electronics Forum | Fri Aug 01 21:10:35 EDT 2008 | leo_dektec

You can keep only the 5th zone as the reflow zone. And lower the first two zones to keep a good ramping rate. Meanwhile,please note the ting temperature in software or control panel is not the exact temperature in your PCB, you'd better get a KIC or

Re: Sequenced tape and reel

Electronics Forum | Thu Apr 27 18:51:35 EDT 2000 | Doug Philbrick

Rob We could do that for you as well as provide you with a ready to run insertion program for your Universal Axial inserter that will of course match your sequences. You can call me at 770 965-3300. I will be out in the morning on the 28th but will


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