New Equipment | Surface Finish
The Minilock-Phantom is the first RIE system in the industry to incorporate a vacuum load-lock on a compact platform. The system has been designed to meet all the safety and equipment needs for the most challenging processes including etch applicatio
New Equipment | Solder Materials
Kapp Lunar Flux™ is a white paste for the high temperature soldering of Aluminum and Zinc die cast alloy. It is a reaction-type flux with 70% active ingredients dispersed in alcohol. Kapp Lunar Flux™ has considerable shelf life stability, as the susp
New Equipment | Test Equipment
The new AutoSIR2™ system represents a dramatic improvement over existing SIR test alternatives, and its shielded precision electronics allows state-of-the-art accuracy resistance measurements to be made up to 1014 ω. One AutoSIR chassis can hold bet
Technical Library | 2022-01-05 22:51:59.0
200 °C) and high pressure. In this paper, a small-molecule assisted approach based on dynamic reaction was proposed to dissolve thermosetting polymers containing ester groups and recycle electronic components from PCBs.
Technical Library | 2022-03-16 19:48:18.0
Dendrites, Electrochemical Migration (ECM) and parasitic leakage, are usually caused by process related contamination. For example, excess flux, poor handling, extraneous solder, fibers, to name a few. One does not normally relate these fails with environmental causes. However, creep corrosion is a mechanism by which electronic products fail in application, primarily related to sulfur pollution present in the air.1 The sulfur reacts with exposed silver, and to a lesser extent, exposed copper. This paper will explore various aspects of the creep corrosion chemical reaction
Technical Library | 2014-07-02 16:46:09.0
Growth behaviors of intermetallic compounds (IMCs) and Kirkendall voids in Cu/Sn/Cu microbump were systematically investigated by an in-situ scanning electron microscope observation. Cu–Sn IMC total thickness increased linearly with the square root of the annealing time for 600 h at 150°C, which could be separated as first and second IMC growth steps. Our results showed that the growth behavior of the first void matched the growth behavior of second Cu6Sn5, and that the growth behavior of the second void matched that of the second Cu3Sn. It could be confirmed that double-layer Kirkendall voids growth kinetics were closely related to the Cu–Sn IMC growth mechanism in the Cu/Sn/Cu microbump, which could seriously deteriorate the mechanical and electrical reliabilities of the fine-pitch microbump systems
Career Center | Suwanee, Georgia USA | Research and Development
Alpha Advanced Materials, a MacDermid Performance Solutions Business, and a leader in providing global semiconductor packaging manufacturers with innovative, high performance materials, is seeking a Formulation Chemist for their Suwanee, GA Research
Industry News | 2017-09-05 16:09:04.0
Datest today announced that its President Robert Boguski will Chair Session TI Keynote & TI3 during SMTA International. The session, entitled, “The Roadmap and the Reaction: Challenges and Responses in Advanced Assembly Technology,” is scheduled to take place Monday, Sept. 18, 2017 from 12:30 – 3 p.m. in Room 48. Speakers for the session include keynote speaker, Bill Bader from iNEMI, John Timmerman, Ph.D. from Henkel and Luis Carlos Montemayor from Dow Corning Corporation.
Industry News | 2015-10-19 12:58:40.0
Morgan Advanced Materials announces it has received a favorable letter of opinion from the U.S. Food and Drug Administration (FDA) for a variety of its carbon/graphite, sintered silicon carbide, and reaction bonded silicon carbide materials produced by its Seals and Bearings business. The letter of opinion covers repeated-use, wear components for food applications, including mechanical face seals, bearing, bushings, vanes, and rotors.
Industry News | 2019-06-16 19:36:42.0
PVA recently published a white paper entitled, “Meter-Mix Dispensing Basics.” The paper, written by Jon Urquhart, PVA’s Director – Applications Engineering, explains that most often in electronics and industrial dispensing, meter-mix dispensing is based upon processing a two-part adhesive that is supplied as a base component plus a hardener component that, when mixed in the proper volume and ratio, cause a chemical chain reaction that initiates the curing process of the mixture.
