Electronics Forum | Thu Aug 27 20:06:25 EDT 1998 | Kallol Chakraborty
Hi folks, Lately I am also having problem with BGA ball problem. We are finding more and more on X-ray analysis and is very expensive to replace. I know for sure that we could rework on CCGA but there is no certified process in industry as we speak
Electronics Forum | Wed Nov 01 13:44:50 EST 2000 | Thomas Ballhausen
Using convection type reflow we observed following problem: One ball of a 313-PBGA appears to be dewetting. This happens randomly, i.e. no specific ball location, failure rate is rather low (3-4%), but since there are 12 PBGAs on one board the failu
Electronics Forum | Wed Mar 11 15:16:42 EST 1998 | Robert Joosten
| | Can anyone give me any info on the effective removal of BGA's? I need to be able to take a variety of BGA's off boards quickly without creating pad damage. I am not yet concerned about the re-attach process. | Hi Craig, | I have been researching
Electronics Forum | Tue Feb 24 07:13:50 EST 1998 | mike foley
| Can anyone give me any info on the effective removal of BGA's? I need to be able to take a variety of BGA's off boards quickly without creating pad damage. I am not yet concerned about the re-attach process. Hi Craig, I have been researching BGA re
Electronics Forum | Mon Feb 11 13:28:36 EST 2002 | stepheno
We have some BGA's that don't solder very well. They weren't properly stored in regards to moisture protection. The balls look dull and rough. After reflow there seemed to be a diffinate line between the balls and the solder on the PCB's. I think
Electronics Forum | Wed Aug 04 20:06:24 EDT 2004 | C.W
Customer returned a brd claim that one of the FPGA is having "cold solder joint". I inspected the the BGA location with X-ray and Ersascope, balls' shape look fine, voids are not detected, perimeter joints show shinny and smooth appearance, i have se
Electronics Forum | Fri Nov 03 12:06:07 EST 2006 | mika
Interesting. We are also facing this problem due to; once in a while a matrix tray is mishandled by the operators and as a result those very, very expensive components falls to the floor and the columns got bent. We manage somethime to "straighten th
Electronics Forum | Sat Mar 14 10:16:54 EST 1998 | Clyde F
| | | Can anyone give me any info on the effective removal of BGA's? I need to be able to take a variety of BGA's off boards quickly without creating pad damage. I am not yet concerned about the re-attach process. | | Hi Craig, | | I have been resear
Electronics Forum | Tue Jul 03 02:42:37 EDT 2012 | kq702
Hi I did a reflow on an HP laptop a while back- it was a DV6000 series. The original problem was the internet stopped working- turns out the south bridge chipset was causing the issue (its a very common issue I found out after searching online). Some
