Electronics Forum: reballing and problem (Page 4 of 65)

QFN's and LGA's

Electronics Forum | Wed May 20 17:18:09 EDT 2009 | daxman

Just out of curiosity, how are you or anyone else determining a defect? Last I checked, IPC had no criteria yet for solder defects for QFN components. Has this changed? Biggest problems we see are voids which our x-ray shows a lot of. Our problems

SMT optimization and improvement

Electronics Forum | Wed May 31 22:17:24 EDT 2006 | EC

Hi Jack, I do not know what type of machine you are using and how old is your machine. But I have this problem before using Fuji machine. There are few things cause part throw.....placment speed, feeder, pick up tolerance, part dimension tolerance,

Reflow glue and past.

Electronics Forum | Tue Feb 08 12:36:28 EST 2000 | Charlie

I'm looking for information from both those who do cure glue and reflow past with the same profile and those who have tried and decided against it. What were the problem? What are the limitations?

BGA and Gold Boards

Electronics Forum | Fri Jun 19 09:45:21 EDT 1998 | Mike Cox

Has anyone had experience with placing BGA on gold plated boards. I thought I read a while ago there was a problem with embrittlment causing cracked joints. If anyone has experience with this your feedback would be great. Mike

solderability and hasl thickness

Electronics Forum | Tue Sep 09 15:10:01 EDT 2003 | swagner

Has anyone had negative experiences with hasl thicknesses below .00005'' of an inch on copper? If so could you please respond with what the problems were. Thanks in advance!!!

Pick and place labels

Electronics Forum | Thu Sep 23 11:50:54 EDT 2004 | JB

We are using a standard nozzle Once placed, the label is not flat, the ends of the label are slightly lifted on both ends. The label is .650 x .200 Have you guys run into a similar problem?

Immersion gold and BGAs

Electronics Forum | Fri Aug 26 09:48:11 EDT 2005 | David

I have heard that there are problems using immersion gold on PCBs when working with BGAs. Is this correct? Is white tin more suitable?

SMT optimization and improvement

Electronics Forum | Mon May 29 12:00:05 EDT 2006 | jbrower

Howdy Jack, That is a huge request, It would help if you start from the begining of your process and break down the problems that you are having.

Solder Balls and Humidity

Electronics Forum | Fri Aug 24 09:29:08 EDT 2007 | jgrootkoerkamp

Solder balls with wave soldering can have different causes. The two most important are the solderresist and the flux. I have similar problems, after changes the flux type 90% off all solderballs are gone. KR, Joris Groot koerkamp

Tp9 and Tp9 ufp

Electronics Forum | Tue Oct 25 15:03:48 EDT 2011 | sjs2303

Hi Bert, For your second issue, are the tools well lubricated? If not the Midas head can fail to grab the tool and can generate the z motor error. Doing this followed by a base-centre level measurement should resolve your problem. Steve

reballing and problem searches for Companies, Equipment, Machines, Suppliers & Information

Reflow Oven

Easily dispense fine pitch components with ±25µm positioning accuracy.
Global manufacturing solutions provider

IPC Certification Training from the comfort of your home or office
PCB separator

ONLINE IPC Training & Certification