Electronics Forum | Fri Sep 24 18:44:17 EDT 2021 | proceng1
This is what I do to determine if the oven recipe is the cause. Change the rotation that the board travels through the oven.
Electronics Forum | Mon Dec 02 21:32:34 EST 2002 | davef
Sounds like you're killing the poor little critters. Tell us about: * Placement force. * Reflow method. * Where and how you are measuring your reflow recipe. * Cooling rate of the reflow recipe. * How the solder connection to the metalization appear
Electronics Forum | Mon Jun 09 17:41:45 EDT 2003 | davef
Welcome. You have selected a fascinating area to work. "What is delta temperature? Depends on what someone is talking about. Here's some possibilities: * In process equipment definition, the difference in temperature from one side of conveyor to
Electronics Forum | Thu Sep 04 12:07:18 EDT 2003 | cyber_wolf
Hi all, We recently purchased an Omniflow 10 and I am setting up some new recipes. I am told that you can crank the belt speed up pretty fast on this oven. The recipe I am working on now has a belt speed of 30 ipm. What should I have the belt speed
Electronics Forum | Thu Oct 09 15:57:00 EDT 2003 | davef
Start your recipe development with the recommendations of your paste supplier. The recipe in your new oven should produce identical results to your old oven [assuming you're using the same paste]. Given that your new oven is shorter than your old
Electronics Forum | Sat Nov 03 09:39:27 EDT 2007 | davef
Flux exhaused or CSP never came to peak temperature * BGA balls don't combine with the solder => Flux exhaused or BGA balls never came to peak temperature * 0402 surface looks like many tin balls piled together => Flux exhaused Start your thermal
Electronics Forum | Sat May 15 11:27:26 EDT 2010 | davef
We'd expect both OSP poor wetting and improper reflow recipe to show-up in more places than just this one component. But if those are the only choices, we'll go for 'wrong solder paste.' Ooops, that's not one of the choices. Ok, OK, we'll take poo
Electronics Forum | Mon Jun 27 08:18:47 EDT 2022 | kelvinchoong
Hi All, Appreciate any inputs that may be given. Currently i am operating VP6000 Vapour Phase Reflow Oven from ASSCON. Over the last 2 years, we have around 100 different Recipes for many different PCBs. Each recipe is adjusted(6 Different Paramete
Electronics Forum | Tue Dec 08 11:49:44 EST 1998 | Dave F
All Y'All: A recent (10/98) article in "Circuits Assembly" magazine touted the use batch cleaners using a aqueous alcohol solvent. Reported benefits of this approach were: 1 Better use of floor space 2 Ability to develop custom recipes 3 Ability
Electronics Forum | Wed Apr 09 11:23:02 EDT 2003 | davef
Nice pix. The pebbly texture that you're seeing is aptly called "orange peel". Temperature appears to significantly influence the appearance of solder spheres during soldering. Indeed, when the reflow temperature is high, tin continues smelting long
