Electronics Forum | Wed Sep 01 06:18:05 EDT 2010 | grahamcooper22
Dear SMT Manufacturer, As moisture is eliminated as the cause then solder paste volume will probably be the main contributing factor. More paste means more chance of solder balls and more flux fumes that need to be evaporated to reduce voiding. Even
Electronics Forum | Thu May 08 19:52:40 EDT 2014 | hegemon
There are many different style LGA packages, but don't sweat it. Stick with the manufacturers recommendations for PWB pad geometry for a start. Voiding can be reduced by careful profiling, and also by pre-tinning the devices. QFN style packages can b
Electronics Forum | Tue Aug 14 08:19:45 EDT 2018 | buckcho
Hello, other colleagues gave you valid ideas. I found it helpful if i reduce the size of the cooling openings. I would suggest making the four big square into very small many diamonds. This would maybe decrease your voiding with 2-4 percent. Btw how
Electronics Forum | Wed Apr 16 11:20:31 EDT 2003 | russ
What was the original complaint? when you say solder wicked onto top of capacitor do you mean it was dewetted from the board and only on the cap? What type of device showed voiding? how bad was it 20%,50%? I have found that the paste type seems to
Electronics Forum | Thu Oct 25 13:35:47 EDT 2012 | davef
Here's a paper that may help http://www.ipcoutlook.org/pdf/assembly_challenges_bottom_terminated_ipc.pdf Temperature Impact * Profile didn’t have a significant impact on voiding. * Voids slightly increased with higher temperature. Reflow Atmosp
Electronics Forum | Wed Jan 19 00:42:09 EST 2000 | park kyung sam
In my case, when i solderd the bga in normal reflow(convection hot air). There is a lot of boid. i had tried to reduce void long time. so i reduced just a little. It did't satisfied me but now i cannot looking for the void in soldered bga i
Electronics Forum | Fri Mar 04 01:08:19 EST 2011 | kemasta
Thanks davef Bridging:- There is no heat sink on the BGA, the heat sink will be fix after relow. I do believe paste had something to do with it, but currently this defect didn't appear so oftenly, so we think that the main root cause is not from the
Electronics Forum | Mon May 09 14:36:49 EDT 2005 | driscolj
We've had similar problems with Indium 6.2 water soluble paste. We reduced our voiding by implementing a longer soak and lower peak temperature.
Electronics Forum | Fri Feb 13 11:46:23 EST 2004 | Jack
Is your customer trying to reduce voiding? If the device is using Sn90 / Pb10 and the paste is Sn63/Pb37 the board will melt first. However, if both solders are 183C eutectic, it's a tossup? PCB design, copper weight, bga type (pbga, micro bga, Tbg
Electronics Forum | Mon Nov 26 13:40:40 EST 2018 | robl
Hi Prem, Yes, the flux in the Cobar paste helped with wetting and joint strength, as does reducing voids as there is more solder in the joint, as does cooling rate. Regarding peel test in KG, it depends on the pad size and volume of solder in the j
