Electronics Forum | Wed Jan 30 12:37:49 EST 2002 | jax
nifhail, In a nutshell: Vapor-phase reflow is a process that uses a fluid with a selected boiling point. As condensation of the hot vapor occurs on a cool assembly the assembly's temperature is rapidly raised to match the temperature of the vapor.
Electronics Forum | Fri Feb 01 10:57:52 EST 2002 | davef
Yes, that's what people are thinking. The 217�C melting temperature that you mention requires a ~250�C reflow temperature. Generally, boards, legend ink, and components cannot take that temperature. Further, few ovens can produce that temperature
Electronics Forum | Wed Dec 04 04:29:51 EST 2002 | CH
U might need to run the board on a reflow pallet with a clamper. This will help to solve the warpage problem on the PCB and connector.
Electronics Forum | Thu Apr 05 07:02:22 EDT 2007 | pavel_murtishev
Good afternoon, Thanks for input AR. Fortunately, supplier can offer us nickel barrier alternative. I will do exactly as you did. BR, Pavel
Electronics Forum | Wed Apr 18 06:18:53 EDT 2007 | pavel_murtishev
Good afternoon, Huh. My sympathy. We have the same issue. Check this: http://www.smtnet.com/Forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=11637&mc=3 BR, Pavel
Electronics Forum | Fri Feb 01 06:15:46 EST 2002 | nifhail
This can be a solution for IC/BGA soldering for lead-free process isn't it ? See, most of the reflow profile set meets solder paste specification but often violating ICs or BGA requirement. Most of the solder paste required temperature of about 205 -
Electronics Forum | Sat Nov 23 10:19:39 EST 2002 | davef
This sounds alot like the warping that we all see periodically in BGA. CTE of material is temperature dependent and not temperature changing rate dependent, so you are pretty much hosed by the physics. Regardless, I do like trying like crazy to g
Electronics Forum | Wed Jan 30 17:48:31 EST 2002 | davef
Expanding on a previous poster's comments ... Vapor Phase Soldering. A solder reflow technology that uses a heated solvent to melt the solder. Buried deep in the recesses of the SMTnet Library is �Terms & Definitions�. We started using vapor phas
Electronics Forum | Wed Apr 04 03:07:16 EDT 2007 | pavel_murtishev
Good morning, Problem definition Poor soldering of thermistors with Ag/Pd termination Background Process: lead free reflow soldering Paste type: Multicore LF300, SAC305 Component type: 0805 chip thermistor, Ag/Pd termination PWB finish: immersion A
Electronics Forum | Wed Apr 04 04:26:08 EDT 2007 | AR
Pavel, We had exactly the same kind of problem with exactly the same type of component. Our components were well within their best before -date so it is not question of that. As we could not get it to work we changed to nickel barrier finish on the
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