Electronics Forum: rosin and humidity (Page 4 of 7)

Re: BGA and Gold Boards

Electronics Forum | Wed Jun 24 16:23:29 EDT 1998 | Justin Medernach

| Has anyone had experience with placing BGA on gold plated boards. I thought I read a while ago there was a problem with embrittlment causing cracked joints. If anyone has experience with this your feedback would be great. | Mike Mike, Your concer

J-STD-001 Par 4.2.2 Temperature and Humidity

Electronics Forum | Tue Jul 17 21:48:09 EDT 2007 | davef

Per ESD Handbook TR 20.20 paragraph 5.3.15 Humidity "Humidity is beneficial in all ESD Control Program Plans. Contact and separation of dry materials generates greater electrostatic charges than moist materials because moisture provides conductivity

Re: BGA and Gold Boards

Electronics Forum | Thu Jun 25 09:53:04 EDT 1998 | Earl Moon

| | Has anyone had experience with placing BGA on gold plated boards. I thought I read a while ago there was a problem with embrittlment causing cracked joints. If anyone has experience with this your feedback would be great. | | Mike | Mike, | You

CCGA - Stencil design and Reflow Profiling

Electronics Forum | Wed Aug 21 13:28:20 EDT 2019 | ameenullakhan

And what is the solder paste selection recommendation for the same. 1. Water soluble ( organic based flux solder based ) 2. No clean ( rosin or resin based solder paste ) customer is suggesting water soluble chemistry , which is having lot hot an

J-STD-001 Par 4.2.2 Temperature and Humidity

Electronics Forum | Mon Jul 16 15:44:27 EDT 2007 | davef

J-STD-001 doesn't necessarily require additional controls under conditions of low humidity, only that you verify the effectiveness of what you have in place. ESD S20.20 [1999] only says that relative humidity above 30% is "desirable". ESD S20.20 [200

floor and air conditioning, shop floor requirements

Electronics Forum | Mon May 06 21:40:40 EDT 2013 | davef

ANSI/J-STD-001: * Temperature and Humidity: 18-30°C, 30-70%RH ** If out of range, shall verify electrostatic discharge control program according to ANSI/ESD S20-20 is adequate. ** For process control, more restrictive temperature and humidity limits

Selective soldering pallets and solder balls

Electronics Forum | Mon Dec 02 18:01:12 EST 2002 | GSW

Hi, Try to check if there is water absorbed in the flux or the humidity around the wave area. possibly plating on barrels that might be damaged?

J-STD-001 Par 4.2.2 Temperature and Humidity

Electronics Forum | Wed Jul 11 14:44:21 EDT 2007 | fredericksr

Hi folks! Has anyone ever successfully verified adequate ESD control at

Re: Solderability of BGA and PCB

Electronics Forum | Mon Nov 20 21:02:46 EST 2000 | Michael Psrker

First question I have for you is: Are you assuming that standard precautions are in place at your facility to minimize moisture content i.e. air- deionizers, vacuum sealed packaging, humidity control in storage and manufacturing? You do not mention

J-STD-001 Par 4.2.2 Temperature and Humidity

Electronics Forum | Wed Jul 18 11:49:59 EDT 2007 | davef

The auditor may be using "verify" in an ESD Program context. See ANSI/ESD S20.20 [1999], 6.1.3, Compliance Verification Plan. It gives one definition of what the auditor may be seeking. For more on verification programs, look here: http://www.protek


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