Electronics Forum: safer (Page 4 of 5)

3 x BGA reflow or placing BGA with repair station?

Electronics Forum | Wed Oct 04 09:55:51 EDT 2006 | borgie

Hi. I have product in lead containing process that consist lead free BGAs and also big ceramic BGAs with high temperature bumbs. Pcb tends to bow in a reflow profile, since I need long preheating times and relatively high peak temperature to melt BG

Soldering Survey

Electronics Forum | Mon Sep 14 23:21:06 EDT 2015 | solderotter

Hi there. We’re Solder Otter, a team of recent engineering graduates from the University of Waterloo in Canada that is redesigning the soldering iron so soldering electronics can be safer and simpler. You may have seen the survey we posted back in 2

Checkpoint BOM duplication problem

Electronics Forum | Wed Mar 30 12:10:40 EDT 2016 | slthomas

Hi All, We use Aegis Checkpoint for BOM management and CircuitCam for programming and work instructions. For reasons beyond my control, we no longer have a service contract. I'm fairly new here so as far as I know the following problem has existed

Re: When using noclean flux or clean flux process?

Electronics Forum | Wed Sep 22 02:45:23 EDT 1999 | Brian

| | Dear All, | | | | In order to understand the soldering technologies in SMT, I'd like to understand why some cards are soldered and then cleaned, or only soldered whitout water cleaning nor "ultra sound" wavelength. | | | | I mean that I wonder

Air-Vac stuff

Electronics Forum | Tue Aug 17 09:59:50 EDT 1999 | Earl Moon

I'm trying a second time to post this very important message, to me, concerning Air-Vac's following creation. Does any own and use this stuff successfully to remove solder from 20 layer and up MLB's with .020" diameter holes? Also, is any of the adve

little green men

Electronics Forum | Sat Jul 17 01:23:29 EDT 1999 | Scott McKee

| | | | I need a good chemical to remove the lacquer finish off of magnet wire. I know there are different kinds but I need one that really works. Any suggestions would be great. thanks in advance guys. | | | | | | | What is it you're trying to do?

Re: Hand-Solder Pre-Heat

Electronics Forum | Sat May 01 04:49:21 EDT 1999 | Jeff Sanchez

| Mornin! | | We just had vendor in here pitching a "low-temperature rework system" which was intriguing, but too expensive. He did get me to thinking though, beyond heating ceramic caps before hand-soldering them, it seems like it would be ad

Re: Environmental Issues

Electronics Forum | Fri May 22 11:59:54 EDT 1998 | Earl Moon

| I hear ya' Earl! I don't know why there seems to be such a push for us to eliminate lead...you're right, assemblers are pretty clean when it comes to lead....actually, the whole industry is, when compared to other industries and the amounts of lead

Moisture Barrier bags

Electronics Forum | Fri May 03 10:51:24 EDT 2002 | fmonette

Dave is correct. I am including additional information that comes from a recent posting on another industry forum : The proper guidelines for bag sealing are actually specified in the JEDEC standard EIA/JEP124 section 5.2.1 Packing moisture-sensiti

Re: Air-Vac stuff

Electronics Forum | Thu Aug 19 22:59:48 EDT 1999 | Jeff Ferry

| I'm trying a second time to post this very important message, to me, concerning Air-Vac's following creation. Does any own and use this stuff successfully to remove solder from 20 layer and up MLB's with .020" diameter holes? Also, is any of the ad


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