Electronics Forum | Thu Aug 26 22:44:40 EDT 2004 | Indy
We do perform multiple reflow only for reliability testing. 90% of the time we have not seen any change in the solder joint and no change in electricals. If you do see failure you might want to see the solderability of the surface finish too.. jus
Electronics Forum | Thu May 05 16:02:43 EDT 2005 | russ
I don't believe that you are seeing black pad. I think you are seeing an oxidized pad from your statement that these pads take solder. I would guess that these will be fine. But I would re-tin all pads prior to attaching the BGA to make sure.
Electronics Forum | Thu Sep 27 09:28:42 EDT 2007 | jgrootkoerkamp
Thanks for all the answers. Is it also possible with lead free soldering to produce little holes in the solder that are not blowholes? We see holes where you can see the end of the hole (not very deep). The holes are always on the same places.