Electronics Forum | Sun Oct 07 07:34:25 EDT 2001 | davef
No one wants to be limited to one alternative in evaluating such equipment. Who would you suggest as viable alternatives to: * Cyber Optics in evaluating alternate suppliers for inspection equipment? * Royce Instruments in evaluating alternate sup
Electronics Forum | Tue Jan 29 22:01:51 EST 2008 | davef
These test are largely useless. Check the fine SMTnet Archives for previous rants. Manufacturers of machines to use are: * Peel tests: Instron [Instron Worldwide Headquarters; 825 University Ave, Norwood, MA 02062-2643; 800 877 6674 http://www.inst
Electronics Forum | Thu May 13 16:59:08 EDT 1999 | KT
Looking for a reasonably priced portable device to do strength test(shear/twist)on glue cured Cap/Res. Any suggestions? Thanks
Electronics Forum | Tue Sep 04 10:48:49 EDT 2007 | lloyd
How do other people check their solder joint strength after a process change? For example, say you are getting wetting problems and you feel that a change to the reflow profile may help, or perhaps a slight change to the stencil aperture to reduce so
Electronics Forum | Wed Dec 10 11:11:04 EST 1997 | Rich Scheleski
Is there a spec for the adhesives used to hold down parts before wave soldering. What size dots are recommended and what is the maximum shear force(1LB?) tested for to ensure good adhesion. Your help is appreciated Rich Scheleski
Electronics Forum | Thu Sep 30 12:02:20 EDT 1999 | Wolfgang Busko
| I am having problems processing immersion gold boards. The achieved solder joints appear acceptable a la IPC-A-610, but the resultant joint does not fully cover the land, i.e. you can still see an outline of gold pad. | What is the best way to achi
Electronics Forum | Mon Dec 19 10:23:47 EST 2005 | DannyJ
Hi Grant, Here's one paper I came across for a customer of ours, seems they had heard that pb-free bgas cannot be done in pb paste. http://www.leadfreemagazine.com/pages/pdf/Clech_APEX2004_Paper-final.pdf I have another from a swiss lab that did
Electronics Forum | Wed Sep 29 09:35:39 EDT 2010 | blnorman
Can any body help me that how can I check the > strength of the 0603 capacitor & how much it > should be? Is there any standard for the > soldering strength of the Diffrent SMT > packages. Manjeet singh I'm not aware of a standard that provides
Electronics Forum | Fri Oct 01 16:17:10 EDT 1999 | Dave F
| I am currently in the middle of a company wide war and I'm looking for data (AMMO). Here are the problems: | | 1) I am looking for anyone who has done or seen any reports on Thermal Shock to smt parts and/or via holes caused by Soldering Irons at
Electronics Forum | Wed Jan 17 20:48:14 EST 2001 | davef
We find that the raw BGA's pad sheared surface has the SnPb solder at various Z heights whereas the assembled BGAs pad leave a smooth layer of SnPb along the pad. Like to understand the cause for the difference. Who could guess? Solder joint streng
