Electronics Forum | Thu Jul 01 11:48:10 EDT 2010 | mb_mfg
Sid, Try baking the boards before running, to insure no moisture. Baking out the moisture will help prevent warping. Should you need further assistance, we supply fixtures to force the board to stay flat to reduce to thermo shock during wave solde
Electronics Forum | Tue Jun 22 08:37:52 EDT 2010 | davef
Dennis: These "terminal detach failures" probably are caused by thermal shocking of the components. * Preheat the components * Use a hot air pencil rather than a soldering iron
Electronics Forum | Tue May 10 17:05:14 EDT 2011 | markhoch
I've found Electro-Shock Behavior Modification tools to be quite helpful.... You've got to crank the voltage up a little at first, but once you hit 'em two or three times you can turn it back down.
Electronics Forum | Thu Jun 06 12:54:23 EDT 2013 | emeto
I think that you will be fine. You don't want to crack the part during it's stay on a high temperature in the reflow oven(thermal shock...thermal stress...). Once you mount the part on the board it will collect moisture again, but it is already proce
Electronics Forum | Fri Sep 06 07:40:02 EDT 2013 | spoiltforchoice
gold, one of the stablest elements on the periodic table oxidising. Are you sure, and why would you want to reduce the vision fail rate on a part that is clearly shockingly poor?
Electronics Forum | Mon Jun 09 11:11:57 EDT 2014 | cyber_wolf
What does the technical data sheet for the component recommend for reflow profile ? Can you post a photo of the component ?
Electronics Forum | Sat Oct 07 10:16:00 EDT 2017 | tsvetan
1. Secure all linear bearings to not move during the transport 2. Wrap the machine completely with stretch folio to protect from dust and moisture 3. Attach shock sensor to it so when it arrive you can see if it was subject to harsh transport
Electronics Forum | Fri Jun 21 03:05:41 EDT 2019 | gregoryyork
The only problem with non silver tin bismuth is its very prone to shock damage and components fall off,literally. Would only recommend it with Silver additions and around 1%.
Electronics Forum | Thu Aug 15 09:36:48 EDT 2019 | davef
It could be delamination of the layered material of the MLCC caused by thermal shock or a component fabrication defect. For more on MLCC cracks: https://www.avx.com/docs/techinfo/CeramicCapacitors/cracks.pdf
Electronics Forum | Fri Oct 01 02:46:47 EDT 2021 | sn
Thanks, Evtimov. In terms of mechanical drop performance, can we conclude that the higher Ag alloy will have poorer drop shock performance relatively compare to those with lower Ag? The Ag3Sn is a good IMC for welding strength?
