Electronics Forum | Mon Apr 25 22:56:44 EDT 2005 | davef
rush316 First, no one stated that PBB and/or PCBE are in FR4. FR4 contain tetra-bromo-bisphenol A [TBBA]. Second, there are classes [and grades] of dielectric materials used in fabricating printed circuit boards. Grades, NEMA LI-1. From these gr
Electronics Forum | Tue Jan 26 10:47:39 EST 2010 | oeidave
Hi, Thank you for posting your question. Omron Electronics provides both High End AOI and 3D SPI systems. I believe that our S7oo series AOi and VP 5000 or VP 6000 3D SPI systems will meet your needs. Please feel free to contact me via email (david.
Electronics Forum | Thu Feb 25 11:09:34 EST 1999 | Joe
We are trying to decide between a Contact Systems Model 3AV or a Multitronix Model DHM120 P&P machine. Any advice or feedback would be apreciated. Joe
Electronics Forum | Fri Aug 23 18:51:00 EDT 2002 | edahi
weve done a few evaluations for the no-flow underfill and for the reliability I think it has already passed MRT L3 @ 220C reflow. What is it specifically you're interested about the flow u/fill??
Electronics Forum | Thu Mar 11 11:49:22 EST 2004 | caldon
www.ox3.com has a great web site. 1) they have a pdf that you can use for $ or 2) they have an online glossary with parts and cost available. Cal
Electronics Forum | Fri Aug 14 14:45:23 EDT 2015 | avg1
I am looking for a company that does repair and maintenance on Assembleon pick and place machines. We have 3 Assembleon Topaz-X machines that need to be calibrated and head repaired. I received a quote from Assembleon which was outrageous. Any inf
Electronics Forum | Wed Oct 10 12:22:08 EDT 2001 | Kevin
Cal, There are several suppliers of cover tape materials that do not require heat to activate the adhesive. 3M and Advantek are likely the leaders. There are relatively few T&R machines that can handle both heat and non-heat applications - as Chri
Electronics Forum | Tue Aug 28 16:05:21 EDT 2001 | stefan
I did not question the accuracy, which is very good, but only 99.8 % of the time. If I require this accuracy for a certain part to be placed, than I want to have this part on target more often than 3 sigma permits.
Electronics Forum | Wed Aug 21 17:44:32 EDT 2002 | davef
Splitting hairs, I expect SIR of all solderability protection, including OSP, to decrease after reflow. What�s more, I expect the SIR of all solderability protection to pretty much decrease over time. The �comb pattern� test specimens meet requirem
Electronics Forum | Tue May 02 15:29:14 EDT 2000 | M. F. Roe
I am looking for public papers or articles on intermetallic formation as a function of reflow profile. Most solder paste vendors specify peak temperature and time above liquidus, but I am particularly interested in what happens to intermetallic grow
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