Electronics Forum | Wed Jan 26 12:36:14 EST 2005 | Rob Wilson
I saw in a presentation that military testing of lead-free soldering for reliability has not gone well. Basically, unlike commercial applications where the alloys performed better they did worse when under the more extreme military and aerospace con
Electronics Forum | Wed Aug 15 16:04:23 EDT 2001 | davef
First, responding to your question � Several things on copper dissolution in solder are: * A 50um copper wire will dissolve in 60Sn / 40Pb solder at: - 200�C solder in 55 seconds; - 250�C solder in 20 seconds; - 300�C solder in 5 seconds; - 350�C so
Electronics Forum | Tue Aug 22 16:02:07 EDT 2000 | Dr. Ning-Cheng Lee
If the thermal mass of the products is small, a tent-shaped profile is recommended, with peak temperature around 240C. The hottest spot on board should be less than 250C. However, if the thermal mass of the product is large, such as a large server PC
Electronics Forum | Tue Dec 15 14:38:23 EST 2020 | emeto
I have done it different ways on different equipment. 1. Remove alloy one from the machine. Add alloy two only. and use it.For next board, do the same. 2. There are machines with separate sections for PB and PC-Free, so pots are away from each other
Electronics Forum | Thu Sep 26 20:43:51 EDT 2002 | davef
"OK. If the connection doesn't look like I expect it to look, how do I know that the metallurgy is correct?" Comments are: * There are no pictures that will get you though this. * You should expect that gold that is dissolved in Pb/Sn solder to make