Electronics Forum: silver palladium leaching (Page 4 of 13)

Ceramic subtrate with silver/palladium surface finish

Electronics Forum | Sat Jul 24 01:52:31 EDT 2004 | C.W

thanks Dave!!

Re: Tombstoning 0805s w/palladium/platinum/silver terminations

Electronics Forum | Mon May 03 09:42:45 EDT 1999 | Mike McMonagle

| Tombstoning 0805s w/palladium/platinum/silver terminations | | We are experiencing tombstoning problems on 0805 packages that have paladium/platinum/silver terminations. It comes & goes...... | | I�ve checked the reflow profile, and paste deposi

Green inductors

Electronics Forum | Mon Feb 20 08:25:13 EST 2006 | Rob

No problem. If you get no joy you're going to have to change the footprint to a 1206 or 1210. Murata have a range of high Q value inductors (50-60) & from memory Toko used to be pretty hot too. The terminations on the coilcraft part are listed a

Re: Chip Resistor Failure

Electronics Forum | Wed Mar 24 09:04:46 EST 1999 | Dave F

| Your problem may be related to silver migration (leaching) into the solder. I had what seems to be a similar problem. The solution was using solder with 2% silver content. See these pages for a bit more information: | | http://www.ferroemd.com/

Re: Surface Mount assemblies IPC Standards

Electronics Forum | Thu Jul 01 16:57:14 EDT 1999 | JohnW

| | | | Could somebody tell me what means Leaching, ie: "Leaching of terminal end face exposing the ceramic"? | | | | | | | Roberto: Leaching, according to the SMTnet Library of Terms: | | | | | | Leaching. Dissolution of a metal coating into liqu

Re: Surface Mount assemblies IPC Standards

Electronics Forum | Thu Jul 01 20:56:57 EDT 1999 | Dave F

| | | | | Could somebody tell me what means Leaching, ie: "Leaching of terminal end face exposing the ceramic"? | | | | | | | | | Roberto: Leaching, according to the SMTnet Library of Terms: | | | | | | | | Leaching. Dissolution of a metal coating

When do you use Tin/Lead/Silver paste ?

Electronics Forum | Wed Feb 20 09:38:47 EST 2002 | davef

Search the fine SMTnet Archives on � Sn62 � 62Sn � 2% Ag � 2% silver � 2Ag � etc re: "Do you have to use Tin/Lead/Silver paste only if the components are made from Tin/Lead/Silver ?" No Several points are: * Component leads with silver in the sol

Ag/Pd termination reflow soldering issues

Electronics Forum | Wed Apr 18 08:14:20 EDT 2007 | davef

Silver palladium termination * AgPd-terminated capacitors are designed for conductive adhesion. Reflow or wave soldering is not recommended. [EPCOS Multilayer ceramic capacitors, Soldering directions, October 2006] * CONDUCTIVE EPOXY BONDING. Epoxy c

Curious PCB technology

Electronics Forum | Mon Jan 27 10:09:33 EST 2020 | charliedci

Looks like a screen printed circuit using a platinum or palladium silver paste. This would account for the grainy appearance. I 've seen this on a white ceramic substrate but not on aluminum. Any components are attached using a silver conductive epox

Re: 0603 Tombstoning

Electronics Forum | Thu Feb 24 11:11:25 EST 2000 | Russ

I have seen this before, our problem was palladium termination of this component. We could not change suppliers so we use a "reverse homeplate" stencil design to put the majority of paste directly underneath the solder terminations of the component


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