Electronics Forum | Tue Feb 08 12:36:28 EST 2000 | Charlie
I'm looking for information from both those who do cure glue and reflow past with the same profile and those who have tried and decided against it. What were the problem? What are the limitations?
Electronics Forum | Fri Jun 19 09:45:21 EDT 1998 | Mike Cox
Has anyone had experience with placing BGA on gold plated boards. I thought I read a while ago there was a problem with embrittlment causing cracked joints. If anyone has experience with this your feedback would be great. Mike
Electronics Forum | Tue Sep 09 15:10:01 EDT 2003 | swagner
Has anyone had negative experiences with hasl thicknesses below .00005'' of an inch on copper? If so could you please respond with what the problems were. Thanks in advance!!!
Electronics Forum | Thu Sep 23 11:50:54 EDT 2004 | JB
We are using a standard nozzle Once placed, the label is not flat, the ends of the label are slightly lifted on both ends. The label is .650 x .200 Have you guys run into a similar problem?
Electronics Forum | Fri Aug 26 09:48:11 EDT 2005 | David
I have heard that there are problems using immersion gold on PCBs when working with BGAs. Is this correct? Is white tin more suitable?
Electronics Forum | Mon May 29 12:00:05 EDT 2006 | jbrower
Howdy Jack, That is a huge request, It would help if you start from the begining of your process and break down the problems that you are having.
Electronics Forum | Fri Aug 24 09:29:08 EDT 2007 | jgrootkoerkamp
Solder balls with wave soldering can have different causes. The two most important are the solderresist and the flux. I have similar problems, after changes the flux type 90% off all solderballs are gone. KR, Joris Groot koerkamp
Electronics Forum | Tue Oct 25 15:03:48 EDT 2011 | sjs2303
Hi Bert, For your second issue, are the tools well lubricated? If not the Midas head can fail to grab the tool and can generate the z motor error. Doing this followed by a base-centre level measurement should resolve your problem. Steve
Electronics Forum | Wed Feb 25 09:19:39 EST 2015 | swiese242
We currently do have part system in place. The problem that we are having is finding the same part used on multiple jobs. We it be sufficient to keep most used and common parts on hand. Then turn kitting into fifo.
Electronics Forum | Wed Jun 05 17:13:58 EDT 2002 | Yannick
Hello! I have a strage problem, we made some production with uBGA, BGA, 0201, 0805, and other type of component. We didn't put the uBGA and 0201 and BGA on the board at the end of the line we look a our solder joint and surprise the solder made a
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