Electronics Forum | Wed Dec 03 11:55:42 EST 2014 | spoiltforchoice
I think there are several answers: 1)Design Fail - slap whoever created it 2)Fit that connector as a manual process after the PCB is finished. 3)Print side 2 using a jet printer 4) Shield the fragile LGA and reflow it twice anyway. 5)Use a thicker PC
Electronics Forum | Mon Dec 20 07:09:03 EST 1999 | Christopher Lampron
Ron, The simplest way to process fexible PCB's that I have found is to use a process carrier fixture. There are companies that manufacture process carriers that are capable of holding flex through stencil, placement and reflow. The carriers are capab
Electronics Forum | Fri Dec 17 03:38:53 EST 1999 | cklau
Hello Guys; I "ll like to add some comment on Mr John message , see below.. "Be sure that the components to be used on the bottom can take the maximum heat of the wave and the delta T of entering the wave."-John The required preheat temp , that i
Electronics Forum | Tue May 04 22:54:54 EDT 2004 | davef
Yeh, the IPC courtyards are for old ladies. I want to say that at one time IPC was talking about a new set of rules. Maybe, 7351 - SMT Footprint Design Guidelines??? Anyhow, Jim Blankenhorn at SMTPlus [ sales@smtplus.com ] has done THE best job o
Electronics Forum | Thu Oct 26 14:41:33 EDT 2000 | Derek Vanditmars
We are planning on replacing a SMT 100Pin QFP with a COB module that will have two dies that are functionaly equivalent to the old part that will not be available. Questions: 1)Suggestions on substrate material FR-4 or something better? 2)Are there d
Electronics Forum | Fri Feb 20 16:37:55 EST 1998 | Lee Ritchey 3Com
| I have developed a method to increase SMT circuit density | up to 40%. Looking for interested PCB fabricators and | designers for process improvement. Earl, We are always interested and working on new designs. How can we get involved?
Electronics Forum | Sun Jun 07 09:43:11 EDT 1998 | Bob Willis
There are some guidlines on design and through hole reflow on my web site to download. Also on pin in hole reflow the SMTA Office has a document on using the tecnology. | R&D is currently designing a board with smt components on both sides of the bo
Electronics Forum | Tue May 26 22:13:15 EDT 1998 | Pat Copeland
R&D is currently designing a board with smt components on both sides of the board. They are adding a 16 pin IC Gull wing. on the bottom side of the board. I have asked for only caps and resistors to be placed on the bottom side. Is there a recommende
Electronics Forum | Fri Feb 20 16:39:51 EST 1998 | Jim Blankenhorn
| I have developed a method to increase SMT circuit density | up to 40%. Looking for interested PCB fabricators and | designers for process improvement. Tell us more. How can it be done and what does it take from a design level. What about solder dra
Electronics Forum | Fri Feb 20 16:34:41 EST 1998 | Jim Humecky Amdahl Corp
| I have developed a method to increase SMT circuit density | up to 40%. Looking for interested PCB fabricators and | designers for process improvement. Earl, What are you doing now. What you're suggesting can't be done without trickery. We've been d
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