Electronics Forum: smt standoff (Page 4 of 5)

BCC Technology --- Placement, Rework, Reflow

Electronics Forum | Mon Mar 25 21:50:10 EST 2002 | davef

Some of this was copped from Fred. There are numerous package types that now fall under the rubric of land grid array [LGA]. Land grid devices [ie, Bumped Chip Carrier� [BCC], LGA, Quad Flat-pack No-lead [QFN], MicroLeadFrame�, etc] are essentially

Re: Screen printing glue for wave soldering SMT components.

Electronics Forum | Mon May 29 02:15:06 EDT 2000 | Dreamsniper

Hi Buddy, We've tried shifting to this process before and from our point of view here are some of the advantage and disadvantages that we discovered. Advantage 1) Cheap Equipment cost as you just need to use your Solder Paste Printer rather than buy

Re: Water Batch Cleaners

Electronics Forum | Sun Jun 27 12:24:43 EDT 1999 | Scott Cook

| We are anticipating switching from RMA to OA flux for both reflow and wavesolder in the next few months. If you use a batch cleaner running DI water only I would like to hear your experiences. How is it for cleaning under low standoff components

Universal Instruments Radial Inserter

Electronics Forum | Fri Jul 20 10:44:56 EDT 2007 | gmoritz

If you bought it from an equipment dealer ... OK, the dealer has come through and is (allegedly) sending a full compliment of documentation to arrive by Monday. > ... they need weekly maintenance ... > ... you WILL need parts for it. ... > Do you

Re: Screen printing glue for wave soldering SMT components.

Electronics Forum | Fri May 26 05:54:40 EDT 2000 | Sal

For the past year now we have been printing adhesive with no real problems. Our printing ranges from 0603's to SOIC using a variation of aperture sizes and metal thickness foils. The crucial parameters are : aperture sizes : These obviously depend o

Re: Aqueous Cleaning

Electronics Forum | Fri Jul 30 20:11:35 EDT 1999 | Mike Konrad

It is true that the use of saponifiers (and other water soluble additives) will lower the surface tension and aid in under component penetration. It is also true, however, that other specific design features within a batch machine can also aid in un

Re: Water Batch Cleaners

Electronics Forum | Mon Jun 28 13:12:34 EDT 1999 | Graham Naisbitt

| | We are anticipating switching from RMA to OA flux for both reflow and wavesolder in the next few months. If you use a batch cleaner running DI water only I would like to hear your experiences. How is it for cleaning under low standoff component

Re: BGA PAd Soldermask

Electronics Forum | Wed Feb 16 21:51:29 EST 2000 | Dave F

Kurt: Lots of choices, not many of them good, yano. 1 So LPI has taken over the market pretty nearly 100%, but it won't "tent" reliably, because it is not very viscous when applied and drops into the hole. So then, tenting/plugging with LPI is bad

Re: BGA PAd Soldermask

Electronics Forum | Wed Feb 16 21:51:29 EST 2000 | Dave F

Kurt: Lots of choices, not many of them good, yano. 1 So LPI has taken over the market pretty nearly 100%, but it won't "tent" reliably, because it is not very viscous when applied and drops into the hole. So then, tenting/plugging with LPI is bad

Cleaning Machine and Chemistry

Electronics Forum | Mon Feb 19 11:36:39 EST 2001 | billschreiber

Hello Mark, I wish it were that simple so I could direct you to a particular manufacturer and stencil cleaner model. Unfortunately, there are several issues complicating the process of cleaning all these applications in one machine. First and fore


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