Electronics Forum | Thu Jun 26 04:34:49 EDT 2003 | emeto
Hi James, I saw very good posts here.Now I will give you one more practical way: 1. My advice is to encrease the temperature(like your first sidgestion). Termostress is important thing so your first zone should be 120-150C. 2. The paste profile. If
Electronics Forum | Tue Oct 27 10:40:32 EST 1998 | Greg Curler
| I know that this not surface mount, but many of us have to perform multipule duties. Can anyone give me some information on this I am having problems getting relibility | getingthe heat seal ribbon to make consistant electrical contact. | Any help
Electronics Forum | Sat Oct 24 23:30:59 EDT 1998 | Pete Sorenson
| I know that this not surface mount, but many of us have to perform multipule duties. Can anyone give me some information on this I am having problems getting relibility | getingthe heat seal ribbon to make consistant electrical contact. | Any help
Electronics Forum | Thu Jul 01 16:57:14 EDT 1999 | JohnW
| | | | Could somebody tell me what means Leaching, ie: "Leaching of terminal end face exposing the ceramic"? | | | | | | | Roberto: Leaching, according to the SMTnet Library of Terms: | | | | | | Leaching. Dissolution of a metal coating into liqu
Electronics Forum | Thu Jul 01 20:56:57 EDT 1999 | Dave F
| | | | | Could somebody tell me what means Leaching, ie: "Leaching of terminal end face exposing the ceramic"? | | | | | | | | | Roberto: Leaching, according to the SMTnet Library of Terms: | | | | | | | | Leaching. Dissolution of a metal coating
Electronics Forum | Fri Sep 17 03:55:45 EDT 1999 | Brian
| We have some SMT components with gold plated leads. They're actually LCC led packages. A good solder alloy to use would be Indium / Lead to reduce tin dissolution into the gold and avoid the resultant brittle intermetallic compound. However, a reco
Electronics Forum | Fri Sep 17 06:01:12 EDT 1999 | Earl Moon
| | We have some SMT components with gold plated leads. They're actually LCC led packages. A good solder alloy to use would be Indium / Lead to reduce tin dissolution into the gold and avoid the resultant brittle intermetallic compound. However, a re
Electronics Forum | Fri May 17 10:53:15 EDT 2013 | davef
ENEPIG or Imm Pd? Concerns about palladium as a solderability protection are: * Palladium is more difficult to process in fab than gold * Palladium solder alloys can be brittle, similar to gold, without proper soldering process and/or specification/
Electronics Forum | Fri May 17 05:12:51 EDT 2013 | ultimatejoker
What is the disadvantage of palladium plating instead of gold plating? I saw many advantage of palladium plating in term of hardness, wear resistance, and price but why most of the PCB Industries still use gold in PCB pad? Thank you
Electronics Forum | Fri Jun 19 09:45:21 EDT 1998 | Mike Cox
Has anyone had experience with placing BGA on gold plated boards. I thought I read a while ago there was a problem with embrittlment causing cracked joints. If anyone has experience with this your feedback would be great. Mike
