Electronics Forum | Tue Feb 13 14:39:52 EST 2018 | horchak
Your profile reflow temps are too low. Omnix338 has a melting temp of 217-221C. Your right on the edge, and your soak temps should be closer to 150 than 180C. Bottom line too high a soak, too low a reflow. Take it or leave it.1874
Electronics Forum | Mon Jun 14 14:09:23 EDT 2010 | jmedernach
Chris, There are a lot of potential causes for voids. I'll list a few below: a.) cleanliness (or lack there of) b.) Via in pad where said vias are not filled c.) reflow profile design d.) incompatible materials My knee jerk reaction would be to che
Electronics Forum | Wed Jul 11 13:41:37 EDT 2001 | procon
Hi Chris, Dave F is absolutely correct in his assunption that the leads are hotter than the pads. You must profile from the pads to see the exact temperature that they are reaching. If the entire board reflows properly as you described, don't get ca
Electronics Forum | Thu Dec 27 13:04:58 EST 2012 | dyoungquist
From the temps you list, I'm going to assume you are using leaded solder. What type of oven profile are you using: Ramp-Spike or Ramp-Soak-Spike? I think you will have better results if you use the Ramp-Soak-Spike type of oven profile. Better chan
Electronics Forum | Fri Oct 02 10:34:20 EDT 2015 | dyoungquist
After looking at your profile, some general thoughts.... Your profile looks like what is commonly called a ramp-spike profile and not a ramp-soak-spike profile. Going off of Sarason's comment, you may not have a good soak period before the spike in
Electronics Forum | Tue Jun 09 07:23:04 EDT 2020 | ameenullakhan
Hi Team, Please help in suggesting stencil aperture opening for the 0.4 mm pitch BGA. PAD Diameter is 0.24mm. we have 0201 components also in same board. We have HIP in this BGA. Solder paste : Alpha Om5300 ( PB+ solder paste ) type 4 We have tr
Electronics Forum | Wed Aug 23 15:19:11 EDT 2000 | Dr. Ning-Cheng Lee
From solder material point of view, a solder paste with slow coalescence rate, or slow wetting rate, will be most desirable. Processwise, allowing the paste to stay at soaking zone for longer time will dry out the volatiles, and reduce the chance of
Electronics Forum | Thu Oct 28 17:46:44 EDT 1999 | Gary Kemp
My company manufactures memory modules and I'm finding solder specs on the gold fingers following the reflow process. We are using a no-clean solder paste. The spec sheet warns against crossing the 140 degree C mark during the soak stage, preventin
Electronics Forum | Fri May 21 10:16:31 EDT 1999 | Parvez
Dave, i tried reflowing bare boards with only solder printed on em and no component placed. we still got voids as same as when components were placed. so atleast one of that theories(voids due to component/component placement)could be considered to b
Electronics Forum | Wed Jun 03 08:46:32 EDT 1998 | Ryan Jennens
Thanks everybody for the help! We are still working on the bottom side, but the top side solder balling seems to have gone away for now. We flattened out the middle soak zone of the profile, so that rather than an even ramp up, the board heats quick
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