Electronics Forum | Sat Mar 20 21:52:21 EST 1999 | Steve Gregory
| I am looking for clip art images of electronics assembly. Images like wave soldering, surface mount components, soldering irons... just general assembly graphics. Many sites have different individual images that they use I was just wondering if a
Electronics Forum | Thu Jun 24 23:52:36 EDT 1999 | Dean
| | | Dear guys, | | | | | | I have some problem on assembling micro-BGA with solder paste (63/37). The micro-BGA we assmeble is 0.75mm pitch and with 45 pin (solder bump is 96.5/3.5Ag). The stencil is a laser-cut stencil with 5 mil thickness. We
Electronics Forum | Mon Jun 28 11:51:36 EDT 1999 | Brian Wycoff
| | | | Dear guys, | | | | | | | | I have some problem on assembling micro-BGA with solder paste (63/37). The micro-BGA we assmeble is 0.75mm pitch and with 45 pin (solder bump is 96.5/3.5Ag). The stencil is a laser-cut stencil with 5 mil thicknes
Electronics Forum | Thu Mar 25 14:13:13 EST 1999 | Bob Willis
| | I am looking for clip art images of electronics assembly. Images like wave soldering, surface mount components, soldering irons... just general assembly graphics. Many sites have different individual images that they use I was just wondering if
Electronics Forum | Wed Jun 02 09:55:31 EDT 1999 | Jason Gregory
Hello Dan, I have recently started using polyimide, but not for the standard uses. I designed a pallet for holding small, thin (about .0018" thick) RF boards that were being reflowed inside their aluminum housings. They were screwed down to prevent w
Electronics Forum | Tue Feb 26 17:00:15 EST 2008 | slthomas
I haven't had the luxury of machine based pth assembly in quite a while, but when I did, given that the machines control which parts are inserted (and to a lesser degree where they are inserted) we decided not to perform inspection on that part of th
Electronics Forum | Thu Feb 12 11:57:59 EST 2009 | jmiller
i have searched the forum for hours. read all the threads that deals with cleanliness and ionic testing. (http://www.smtnet.com/forums/Index.cfm?CFApp=1&Message_ID=40295) (http://www.smtnet.com/forums/Index.cfm?CFApp=1&Message_ID=22603) (http://www.
Electronics Forum | Sun Oct 03 18:26:17 EDT 1999 | park
What are pro's and con's of reflowing top side first and curing bottom side chip components, and then wave soldering bottom side? How about curing bottom side first and reflowing top side later? What percentage of companies run reflow/cure/wave for
Electronics Forum | Sat Dec 01 09:09:24 EST 2001 | davef
Sounds like a perfect place to start. Sure we all have different perceptions of fun, don't we? Trial by fire, eh? ;-) A prediction: Your cost accountants are going to freak when they compare the production costs for this board to the more famili
Electronics Forum | Fri Jan 21 05:18:55 EST 2000 | Dean
If at all possible avoid mirror assembly BGA designs. It has a higher failure rate when compared to non-overlap designs (life testing). In addition, from a rework point of view, X-ray inspection yields no help when a failure occures. You can't det
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