Electronics Forum | Fri Jul 08 13:09:25 EDT 2011 | joekirin
Thanks for all the input guys! After trying to figure this out in our smt process, we have discovered that the board house did not meet the required pad width for the fine pitched ICs when making the bare boards. Our stencil was cut out to fit the p
Electronics Forum | Tue Apr 13 08:25:15 EDT 2004 | arcandspark
I would have gone to a .004" stencil but again, the board designers, which we have no control over or are we allowed to give input to, have made the pads on all connectors and many other parts so small that we are almost seeing insuffecient solder us
Electronics Forum | Sat Mar 18 02:21:31 EST 2006 | pavel_murtishev
Good morning, Once again a met annoying solder beading issue while producing board with PLL (leadless, contacts from the bottom side of the package). Board has very high placement density and beads appear near PLL package only. This package is finep
Electronics Forum | Tue Feb 22 17:57:32 EST 2005 | Austinj
Most solder paste has a shelf life of 1 week at room temperature after opened, if resealed at the end of the shift/day. Most shelf lives are 4-6 months at 40F (refridgerated) or 1 month at room temp (unopened/sealed). Recommended stencil life is appr
Electronics Forum | Thu Jul 03 12:03:00 EDT 2003 | slthomas
So, there is a crack or gap between: * Solder and component termination. Bingo Correct? Describe: * Coarseness / smoothness of the metal on the termination underneither the crack. * Solder left on the termination. Unfortunately at 45X I can't rea
Electronics Forum | Fri Sep 21 14:03:45 EDT 2001 | jschake
I have observed solder balling for all aperture sizes tested. Solder balling levels appear to be better correlated against the amount of solder paste that is underneath the 0201 component terminations after placement rather than comparing this to th
Electronics Forum | Mon Apr 12 15:52:12 EDT 2004 | wgaffubar
I am using Indium 92J type 4 solder paste due to a BGA site with .008" pads and stencil opening of .009" square and .005" stencil thickness. When I try the type 3 we get insuffecient print. The aspect ratio tells me that I should be using a type 4. T
Electronics Forum | Thu Sep 13 01:37:15 EDT 2007 | pavel_murtishev
Good morning, Overprint, i.e. make stencil openings for your LED larger. Add printer accuracy to aperture size so that paste would always cover the pad. BR, Pavel
Electronics Forum | Sat Sep 15 08:32:57 EDT 2007 | davef
Russ Not that we want to give Matt Kehoe an open shot, but are you sure that flex can stand-up to Sipad?
Electronics Forum | Fri Apr 04 14:49:51 EDT 2008 | tombstone
Flux seperation is a common problem observed due to expiration of paste. The symptom is a yellow layer of flux when you open the jar. Excess flux separation will cause priting problems such as smearing and slumping.
