Electronics Forum | Tue Jul 19 14:33:17 EDT 2011 | ccouture
Has anyone tried using a product thet when applied to a stencil, it facilitates the release of solder paste from the stencil, including the fine pitch openings. It makes the stencil's surface "fluxophobic". Same principle as Rain-X for windshield. A
Electronics Forum | Mon Mar 05 11:04:14 EST 2007 | Yngwie
We are exploring ways to reduce the waste of solder paste. Here are some of the ideas I have in mind: 1) To use paste supplied in Syringe instead of jar. Paste that are opened more than 8 hours will normally be discarded, so we are looking for ways
Electronics Forum | Wed Nov 01 13:44:50 EST 2000 | Thomas Ballhausen
Using convection type reflow we observed following problem: One ball of a 313-PBGA appears to be dewetting. This happens randomly, i.e. no specific ball location, failure rate is rather low (3-4%), but since there are 12 PBGAs on one board the failu
Electronics Forum | Wed Mar 14 07:30:14 EDT 2007 | davef
So, you toss whatever is on the stencil every 8 hours. Correct? How long has it been on the stencil? * If that particular paste has been on the stencil for 8 hours, we'd agree to toss it too. * If paste has been on the stencil for less than 8 hour
Electronics Forum | Wed Mar 07 08:37:29 EST 2007 | davef
First, don't put solder paste in a wave solder pot, the 50% by volume of organics and volatiles will gas off in an astonishing amount of fume, leaving a dismaying mess of spent resin and molten plastic in your pot. Second, when you say, "Paste that
Electronics Forum | Mon May 24 13:33:46 EDT 1999 | Dave F
| We are running a number of boards with 8-10 25 mil PQFPs on board. Our process is mature with at least 3 years experiance and statistically few opens on the QFPs. Our beloved purchasing department has chased the almighty $ and changed FAB vendor
Electronics Forum | Tue Sep 18 19:32:49 EDT 2007 | davef
Welcome Jimmy Let's mince words to help focus on the issues. When you say "QFP area solder paste shifted," do you mean: * Paste printed on land pattern perfectly, but moves after printing. * Paste printed off the land pattern, even though the stenci
Electronics Forum | Sun May 23 15:12:59 EDT 1999 | JohnW
| We are running a number of boards with 8-10 25 mil PQFPs on board. Our process is mature with at least 3 years experiance and statistically few opens on the QFPs. Our beloved purchasing department has chased the almighty $ and changed FAB vendor
Electronics Forum | Sun Mar 26 19:02:05 EST 2006 | ms
Hi We are running automatic stencil printers, open squeegees, stainless stencil, stainless blades, print speed 25-30mm/sec. We have a frustrating consistency issue printing .37x.3mm apertures on a 45pin LGA (11 pads each side, 1 large ground in mid
Electronics Forum | Thu Dec 10 09:06:47 EST 2009 | stepheniii
Just how cold do you store your paste? And what are your solder paste reps like? Here they fall over each other giving support for their paste. And have you seen the problem with flux separation or have you only heard about it?