Electronics Forum | Wed Jul 30 23:16:01 EDT 2003 | praveen
The profile is enclosed.The PBGA is 37x37 mm.I am keeping the gap about 4-5 mm.The profile meets the solder paste spec.Peak temp is 211 deg C,Above melting point 77 sec. rate of heating
Electronics Forum | Tue Mar 18 14:00:25 EDT 2008 | rrpowers
There are 2 reasons for wanting to change to an enclosed print system: - Reduce solder paste usage. (We run a high volume application so any reduction in paste scrap is a big money saver to our company.) - Improved print quality. (Ours is a non-rew
Electronics Forum | Tue Jan 27 03:59:51 EST 2004 | KevC
Hi lads, Can anyone tell me a bit about PT500 application software? I recently had to replace the Hard drive in the host PC for our wave. I re-loaded the system software and re-configured. One thing I noticed however is in the "Calibrate T/C's" opti
Electronics Forum | Thu Jan 27 11:45:04 EST 2005 | Mark
Based on the components mentioned, it sounds like you need a soldering station rather than a bga rework station. The equipment mentioned would allow you to rework fine pitch QFPs and BGAs. Reworking an sot-23 using one of those systems is inefficie
Electronics Forum | Thu Mar 20 18:39:30 EDT 2008 | cmckissick
I am not a big believer in these systems, unless you are doing a no-clean, multi-shift operation with minimum changeover. If you are a small batch shop, the amount of solder paste you end up wasting can actually be the same or more, if you are not r
Electronics Forum | Thu Mar 20 20:57:44 EDT 2008 | rrpowers
Well, we are in fact doing a no-clean, multi-shift, very high volume, minimal changeover operation. We use up any paste long before it gets old. Because of the sheer volume any reduction in paste scrap for us is big money. We also are in a zero de
Electronics Forum | Wed Jul 30 22:37:15 EDT 2003 | Dean
I have been using a srt-1000 since 98. My guess is your heating up the part too fast. What is your heating rate (deg. C per second)? PBGA's do warp. Your profile should mimic your smt process (assuming you have no warping there). Also, check wit
Electronics Forum | Thu Jan 27 11:33:59 EST 2005 | russ
For what you have right now I would recommend that you use soldering iron tips that are made for component removal. until you get BGAs I wouldn't worry a whole lot about the expensive rework equipment. I would use specialty tips and a heat gun wit
Electronics Forum | Fri Sep 27 15:37:05 EDT 2013 | tuxlab
We are thinking of getting a small pcb assembly setup for a small manufacturing co-op here in Los Angeles. Our experience consist of manual soldering of through hole and smt components. A quick search suggests that there are a few turn key opt
Electronics Forum | Tue Mar 18 11:52:38 EDT 2008 | rrpowers
A couple years back we were looking at going to an enclosed solder paste printing process, similar to the ProFlow, Crossflow, or Rheometric Pump. We have older MPM AP25's with a custom transport. Speedline told us that in order to add the RheoPump,
