Electronics Forum | Mon Sep 20 16:27:58 EDT 2004 | blnorman
Besides the processing tests (different print speeds, print delay times, etc.) one test we've had to use is humidity exposure. Solderballing due to high outside humidity is a problem in our plant. So we expose paste to 85% humidity for various time
Electronics Forum | Thu Apr 05 12:25:17 EDT 2001 | Adam
The Solderballs are on the botton side of the board.The solderballs are concentrated around through hole edge connectors, which have a Tin/lead finish and have lead pitch of 2.5mm, on top of this, random solderballs are occuring around test points. T
Electronics Forum | Sat Feb 20 09:56:22 EST 1999 | Tufty
| We are in the process of getting into no-clean paste and fluxes. One important issue in this is sodler balling. I have heard some people say that having a matte finish would help in having lesser solder balls and that the solder balls would not b
Electronics Forum | Tue Jun 04 20:34:28 EDT 2002 | russ
Jason, Excessive thermal ramp rates, misprints, improper pad design, paste type, placement pressure, all can cause solderballs. Do the pads on this board meet IPC 782 criterias? I have found that too much pad underneath component can cause this. A
Electronics Forum | Tue Mar 22 20:33:24 EST 2005 | davef
Q1. What are you guys doing for filled/tented/plugged vias on the BGA site? A2. 2221A, 4.5.1 tells you the vias have to be tented on both sides. Q2. What type of issues can this cause if using no filled/tented/plugged vias on the BGA site? A2. BGA
Electronics Forum | Tue Jun 04 17:21:22 EDT 2002 | jasonfang
I found solderballs are around chip components (on one side of middle area), I checked gerber data, solder paste of aperture on the stencil for these chip components have 5% reduction to solder land on PCB, shape of solder land are square, not home p
Electronics Forum | Thu Jul 20 14:20:17 EDT 2000 | Bob Willis
In real terms the temperature compatibility is the real issue. Yes a component can and in most case will cover the paste. The component standoffs must prevent the body contacting the paste to prevent solderballing. Bob Just back from dinner, my mum
Electronics Forum | Fri Feb 05 09:47:54 EST 1999 | Dave F
| Name of equipment that automatically does the solderballing. Pads are .010" on .050" pitch | Rich: Try Flux free: Scientific Sealing Technology 562.803.3361 Flux: Vanguard 800.524.7897
Electronics Forum | Thu May 01 18:01:38 EDT 2003 | jym2000
Just take care about reflow profile with this kind of product, you can get a bad-formation in your PCB (Flexcable or your flexcircuit) however you want to call... This bad-formations looks like a solderballs (Microscopio) Regards Jesus
Electronics Forum | Thu Jul 15 15:37:29 EDT 2004 | davef
Get started by searching the fine SMTnet Archives. We love talking about tombstoning and solderballs. Good luck.
