Electronics Forum: solderflow and profiles (Page 4 of 23)

Wave and Reflow Profiler

Electronics Forum | Tue Feb 19 07:44:41 EST 2008 | tonyamenson

So just to clarify.... If i bought a KIC 2000 I could run that one unit over both my waves and through both my ovens (leaded and lead-free)? Or would I need additional equipment to use it on the wave?

Wave and Reflow Profiler

Electronics Forum | Wed Feb 20 08:07:46 EST 2008 | ck_the_flip

Here's a good thread on this topic: http://www.smtnet.com//forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=9859&#Message39714

Mixed SAC105 and SAC305

Electronics Forum | Thu May 29 13:12:10 EDT 2008 | yam6rider

Just like to know what you guys thoughts regarding mixed alloys. Production run SAC305 and some components are SAC105. So, which profile should you follow. SAC105? or SAC305.

Mixed SAC105 and SAC305

Electronics Forum | Wed Jul 02 08:30:32 EDT 2008 | interflux_electronics

Why not follow SAC305? you would do so for any other component finish wouldn't you? A component finish of pure Sn would also not call for a pure Sn profile, would it?

Altitude and solder voids

Electronics Forum | Thu Nov 01 10:57:34 EDT 2012 | kris1128

Has anyone heard whether the elevation of a plant can effect solder joint formation? One plant at sea level, one at 7,000 feet elevation... same equipment and profiles, big voiding defects at higher elevation. I did a search and found no similar post

Dye and Pry

Electronics Forum | Thu Mar 13 01:42:58 EDT 2008 | Sean

Thanks Real Chunks and Davef...Yours input is valuable to me. My inputs towards your question asked below: Questions are: * Why did you tell us the following? "This BGA is installed with heatsink (with hook at both side of the heat sink) manually b

0201 and Lead Free

Electronics Forum | Tue Dec 13 17:41:04 EST 2011 | davef

A Study Of 0201’s And Tombstoning In Lead-Free Systems, Phase II Comparison Of Final Finishes And Solder Paste Formulations http://sheaengineering.com/Documents/APEX%2008%200201s%20and%20Tombstoning%20phase%202%20paper.pdf CONCLUSION The condition

0201 and uBGA

Electronics Forum | Mon Sep 23 18:11:10 EDT 2002 | steveb

On an assembly reflowed in air saw the same thing: 0201's with a grainular solder joint, but 0402's and above with perfectly formed joints. Reflow profile all within acceptable tolerances. Reflowing in nitrogen solves this problem, but increases t

Solder and flux

Electronics Forum | Tue Oct 22 17:23:35 EDT 2002 | Yannick

Hi, I wondering if someone know the anwser to that. I'm using a solder paste 63/37 and on the solder joint we have a tiny little layer or flux who is like crystalin. I try to play with my profile the get it off but I don't get much success. So D

SPC and Wave

Electronics Forum | Thu Jul 14 10:41:27 EDT 2005 | slthomas

I guess I took too much time editing my response. :P The bottom line is that unless you're measurements are at least as repeatable and accurate as your machine's closed loop systems, it's a waste of paper *BUT* makes nice wall art for tours. I like


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