Electronics Forum | Wed Aug 09 18:31:11 EDT 2000 | Doug Teeter
Can anyone tell me the cost or estimated cost of soldering BGA's to the PCB (per package, per ball)?? Also, is there a similar cost for Rework
Electronics Forum | Mon Nov 24 14:09:05 EST 2008 | evtimov
I would go with the BGA profile requirements if the other parts MAX temperature allows it.
Electronics Forum | Mon Nov 24 11:19:21 EST 2008 | sjones
I am having problems soldering a Rohs compliant BGA ATMEL AT91RM9200(rohs compliant board) This device recommends a soldering profile from J-STD-20 and a minimum peak package temperature of 250 centigrade,peak 260. However a lot of the other componen
Electronics Forum | Mon Nov 24 11:26:08 EST 2008 | sjones
I am having problems soldering a Rohs compliant BGA ATMEL AT91RM9200(rohs compliant board) This device recommends a soldering profile from J-STD-20 and a minimum peak package temperature of 250 centigrade,peak 260. However a lot of the other componen
Electronics Forum | Thu Nov 27 10:55:51 EST 2008 | muarty
Hi Steve, Are you actually profiling the BGA itself? By that I mean have you, for example, drilled through the underside of the pcb into the balls of the BGA and attached a probe there? You may find that even although the topside components have a p
Electronics Forum | Tue Apr 11 08:57:35 EDT 2000 | Alfred
Can you get me a recommendation regarding a Micro BGA soldering. It is apparent there is a problem and I want to insure success by following recommended practices. Is there a particular solder mask configuration recommended, as far as stencil thick
Electronics Forum | Tue Apr 11 16:11:09 EDT 2000 | Lawrence A. Groves
MPM has a pretty good paper- http://www.speedlinetechnologies.com/document.php3?A=1364&B= this might help
Electronics Forum | Thu Jul 26 17:43:57 EDT 2007 | tphan
Board had a via hole underneath of the solder pad of the BGA. When it run through reflow oven, it caused a lot of void. How to correct this issue?
Electronics Forum | Thu Apr 14 13:24:18 EDT 2016 | davef
I doubt that your problem is driven primarily by irregularities in your circuit board. My bet is that you’re seeing defects caused primarily by the warpage in your LGA. Consider using advice often given for minimizing warpage caused defects in BGA
Electronics Forum | Mon Jul 26 18:01:30 EDT 1999 | Earl Moon
| Presently protos of micro-bgas (80i/o) pitch .030/.031 | 12BGA per assembly | | The board is a (.062, 4 layers) FR-4 using Dry film | Pads .014inch | Vias within footprint .020inch | Vias to be filled by bottom side(solder side) only .030in dia. F
