Electronics Forum | Mon Aug 23 05:00:20 EDT 2004 | Jefflee
Hi, Would like to know if the design of the Bga pad is depth and after used solder wick and soldering iron to remove the the damage solder ball,there are still remaining solder inside the pad.Is there any method to remove the remaining solder. Thank
Electronics Forum | Thu May 26 21:16:54 EDT 2005 | thaqalain
A solder connection that is characterized by the presence of solder beyond the connection area is called: *Excessive solder *Insufficient solder *Open Solder Joint
Electronics Forum | Thu Jun 19 20:52:19 EDT 2008 | davef
Please give us more information about the source of the solder that you mention. Is it: * HASL applied by your supplier * Solder on pads after wave soldering * Solder paste after printing * Solder on pads after reflow soldering ... or what?
Electronics Forum | Mon Oct 20 15:24:52 EDT 2008 | davef
During reflow soldering, sometimes via fill with solder leaving the solder connection starved. Questions are: * Specifically, what is the problem you see? * Do the defective pads show that solder has melted in a uniform fashion? * How do the tempera
Electronics Forum | Mon Apr 05 22:52:40 EDT 2010 | davef
Sounds like you're not getting the solder connection hot enough. Talk about: * Temperature of the solder on the connection * Solder alloy * Board solderability protection * Component solderability protection
Electronics Forum | Fri Jan 18 15:34:51 EST 2013 | ccouture
if your solder wave machine has a removable solder pot, consider getting a second solder pot. So you will start with a brand new empty solder pot. Keep the current one with your current solder as a backup.
Electronics Forum | Mon Oct 15 10:57:32 EDT 2001 | davef
Before this wave solder pallet salesman blather gets too far out-of-control, let�s stop for a minute. The three major approaches you have are: 1 SELECTIVE SOLDERING: Using: * Specialty wave soldering machine to solder specific areas of a board * P
Electronics Forum | Fri Aug 13 09:09:11 EDT 2004 | davef
Solderability standards are: * IPC EIA J-STD-002B - Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires * IPC EIA J-STD-003A - Solderability Tests for Printed Boards Not intending to insult you, but terms used to descr
Electronics Forum | Fri Nov 09 16:58:30 EST 2001 | davef
Go for it!!! You were unspecific, but adding mask to a completed board could cause: * Increased paste thickness, if you have double thickness of solder mask. * Wrinkled and lifted solder mask under the component, if the solderability protection of
Electronics Forum | Tue Aug 12 13:40:08 EDT 2008 | ck_the_flip
GR@ICS: Are you drag soldering or point-to-point soldering? Keep in mind. Drag soldering mimics wave soldering. Molten solder is contacting and dragging across the solder mask. Keep in mind, too, that "semi-matt" or "semi-gloss" will also tend to
