Electronics Forum | Sat Jun 12 16:33:52 EDT 1999 | JohnW
| | Our company is experiencing cracked caps at our pick and place operations. The caps are being placed onto epoxy dots for subsequent wave solder operations. At present, be have set the pressure of the head at 2 in/lbs. This being down from manuf
Electronics Forum | Sun Jan 31 22:55:33 EST 1999 | Dennis O'Donnell
| | Hello Netters, | | | | I need some info, Earl or Dave, I have a PCB that exhibits a white layer on solder side. It does not appear to be surface residues (IPA has no effect), but looks like its under solder mask. My first guess is that the LPI
Electronics Forum | Wed Feb 03 04:44:43 EST 1999 | Jeff Sanchez
| | | Hello Netters, | | | | | | I need some info, Earl or Dave, I have a PCB that exhibits a white layer on solder side. It does not appear to be surface residues (IPA has no effect), but looks like its under solder mask. My first guess is that t
Electronics Forum | Thu Mar 05 16:54:53 EST 1998 | Brian Stumm @ ETS, LLC
Not sure if you are open to looking at additional vendors but if you are we would love to compete for your business. Go to our web site then call or e-mail me for additional information. Sincerely, Brian Stumm Thermal processing consultant Reflow an
Electronics Forum | Sat Apr 18 10:29:47 EDT 1998 | Steve Gregory
| Have mixed technology board and am interested to hear any info on the Nordson non-contact adhesive dispenser. | I woud appriciate any feedback I could get. I am currently using a contact system and am tired of breaking needles and need a way to spe
Electronics Forum | Tue Sep 22 20:08:58 EDT 1998 | Dave Brand
Rick: I'd be happy to give you information on the system benefits and limitations. I work for Asymtek so please email me back so we can talk off-line. Thanks. -Dave Brand | | | Have mixed technology board and am interested to hear any info on the No
Electronics Forum | Thu May 06 18:18:15 EDT 1999 | JohnW
| OK, my manager read an article on printing glue (aaargghh!)and wants to know why we aren't doing it. We currently use Fuji GLs and GDMs to dispense glue. I've never done it, but have seen it done at NEPCON and other shows. It looks OK, BUT what
Electronics Forum | Mon Nov 02 13:24:18 EST 1998 | Ryan Jennens
| Well my process is I'm running my belt speed at 3.50fpm and about 215 to 225 degrees top side. I got my main wave down to a little less than half the board thickness. I'm not using a hot air knife cause we thought it might create more of a problem
Electronics Forum | Thu Mar 01 21:20:47 EST 2007 | J.R.
Let's talk pin holes and blow holes. I've been here since the transistion of leaded to lead-free process started for our company and we purchased a wave machine just to keep up with our lead-free orders. we put out 500-1000 boards a day both leaded a
Electronics Forum | Thu Jul 17 20:46:55 EDT 2008 | davef
Which type? * Solder beads (mid-chip solder balls, attached to the waste line of your chip caps and resistors) This is more paste volume related. * Solder balls that tend to be more randomly scattered (as in spattered)? This tends to be more profile
