Electronics Forum | Wed Jun 12 11:26:50 EDT 2002 | pjc
Sean, Have you contacted Speedline Technologies applications enegineers? They have a lot of knowledge about SPOTT working with customers over the years to develop the process. I myself have experience doing SPOTT. I used Fuji GSP2 printers with overs
Electronics Forum | Wed May 12 16:31:30 EDT 2004 | knollsystems
Hello Solder Doctor; I would be very interested in your file regarding wave process improvements. I have sent an email to you and I hope it gets to you. I have found some other tips from Speedline Technologies. They have a trouble shooting chart th
Electronics Forum | Fri Nov 04 13:00:24 EST 2005 | pjc
Some clarification: Max bottom side component is not 5mm as someone posted, its 12.7mm (0.5"). This is if you're going to have a Gel-Flex block under that component. Any component height at or over 12.7mm must not have a Gel-Flex block under it. Al
Electronics Forum | Thu Apr 12 09:50:51 EDT 2007 | pjc
There have been many designs of apertures for 0402, round, home plate, inverted home plate and various reduction amounts for square or rectangular apertures. What works best for a given application depends on PCB design, solder land finish, stencil t
Electronics Forum | Fri Jul 18 15:25:19 EDT 2014 | davef
The presence of agitation at an air / solution interface and a foaming agent causes foaming. Most water soluble fluxes contain surficants. Surficants are foaming agents. First, it's likely this foaming is caused by poor control of the temperature of
Electronics Forum | Sun Feb 13 15:23:03 EST 2005 | Mike Konrad
There are several manufacturers of batch-format de-fluxing systems. Here is a list of them: Aqueous Technologies http://www.aqueoustech.com (909) 944-7771 Batch and Inline UnitDesign http://www.unitdesign.com (714) 672-9944 Batch Austin American T
Electronics Forum | Thu Sep 06 10:34:21 EDT 2001 | Mike Konrad
Hi Jeff, Sean is correct. Although ultrasonic technology will work in post-reflow de-fluxing applications, you will receive concerns regarding ultrasonic �damage� to wire bonded components. Much has been written to combat this belief but the conce
Electronics Forum | Mon Aug 27 16:38:06 EDT 2001 | seand
Hey guys, Given the fact that i know very little about your product I would say put the burden on the apps engineers at Speedline-Camalot(www.speedlinetechnologies.com). General rules of thumb may not apply depending on your material selection and
Electronics Forum | Fri Sep 07 14:09:57 EDT 2001 | aqueous
Hi Carol, Pressure requirements have changed over the past few years. In the recent past, aqueous cleaning systems relied on high flow, low pressure �flooding� techniques. 20 � 30 PSI pumped through large orifice nozzles. With ever increasing boa
Electronics Forum | Wed Mar 08 17:01:32 EST 2000 | Russ
So far, I have not been able to get any consistant or good results using one of these "problem solvers". I have managed however, to screw up some good processes. I believe that this technology can work though. I would reccomend contacting Speedlin
