Electronics Forum | Mon Dec 09 10:40:31 EST 2002 | MA/NY DDave
Hi I can image too many images for what your product or your process looks like. Think about hiring a consultant to come in and really look at things. YiE, MA/NY DDave
Electronics Forum | Fri Dec 06 13:00:29 EST 2002 | daanterstegge
I wouldn't recommend a metal squeegee, because if you can't wipe the step-etched area completely clean (that's the problem with metal) you'll have problems with the definition of the fine-pitch (it may stick in the holes). Best is a 70 Shore polyuret
Electronics Forum | Mon Dec 09 14:31:21 EST 2002 | swagner
You want to use a rubber squeegee with as high as a durometer as you can get away with, order two or three sets of blades starting with the softest and then progress up the the hardest, the reasoning behind this is the softer squeegees will wear out
Electronics Forum | Wed Feb 22 10:00:58 EST 2006 | dougs
We've just set up a couple of products with 0.5mm pitch uBGA devices on them, i went for 5thou thick, laser cut nickel (to aid paste release) square pads same size as the diameter of the uBGA pads. Or you could go to a 4 thou nickel stencil, better
Electronics Forum | Mon Nov 23 14:35:14 EST 1998 | MMurphy
| Does any body know stencil manufacturer in states or south east asia for electroforming processes and step down from 5mil to 3mil. | | Thanks! | Hi Daniel, let me guess, you were using AMTX? Too bad their out of business, they made good products.
Electronics Forum | Wed May 22 12:39:00 EDT 2002 | pwrgroup
and the two ratio is changed if you use different thickness sheet or step-down or step-up.I think real time calculator of the two ratio is very important for tranfer efficience.
Electronics Forum | Fri Feb 15 08:44:42 EST 2008 | mmjm_1099
FYI, Here are the steps in which we take to get approval. The stencil gerber layer needs final approval through our Engineering dept. What they do is send in a gerber layer from the stencil house and lays it over the current solder paste layer and ve
Electronics Forum | Wed May 22 12:39:06 EDT 2002 | pwrgroup
Hmmm... Why would you want to to this? I > understand your concern, but why not let your > stencil house manipulate your Gerber and send you > a copy of it before they cut a stencil? Saves > you time and money. Sit down with your stencil > m
Electronics Forum | Thu Sep 12 11:26:11 EDT 2002 | scottefiske
CK, If joints have been validated prior to ICT (under BGA Scope), more often than not repeatable joint fractures are due to undo stress being placed on the component during ICT test. Verify ICT probes and fixture. If after proving out fixture/pin com
Electronics Forum | Mon Apr 09 12:52:00 EDT 2018 | slthomas
We are about to do a second iteration of something we struggled mightily with last time and I'm hoping to at least make a step in the right direction. There are 12 of these parts on the board and virtually all of them required removal and replacemen
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